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XCZU9EG-L1FFVC900I

Xilinx

XCZU9EG-L1FFVC900I by Xilinx

XCZU9EG-L1FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it features a supply voltage range of 0.698V to 0.742V and can withstand peak reflow temperature of 245C.

Median Price

$4,270.683

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Nova Conductors

Japan . 51 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 284 parts In-Stock

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$5.524

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Semicontronic

India . 584 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Ampacity Inc.

Singapore . 1,448 parts In-Stock

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One Stop Electronics

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Qasali Group International

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Corohmni

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Aztec Data Supply Inc.

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Modulus Dynamics

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Microchip USA

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Argo Parts USA

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$4,185.269

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Continental Prestige Electronics

USA . 805 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Overview

Boost your projects to a whole new level with the XCZU9EG-L1FFVC900I by Xilinx. Known for their top-quality products, Xilinx delivers cutting-edge solutions in the category of Other Function uPs,uCs & Peripheral ICs. This versatile microprocessor circuit offers industrial-grade performance, with a wide temperature range and a multitude of applications. Trust Xilinx to provide you with the best technology, value, and reliability for all your electronic needs. Elevate your designs with the XCZU9EG-L1FFVC900I today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable material for long-lasting performance.

Surface Mount:

YES - Easy to integrate into circuit board designs.

Maximum Supply Voltage:

0.742 V - Ensures safe operation within specified limits.

Package Shape:

RECTANGULAR - Space-efficient design for compact applications.

No. of Terminals:

900 - Offers ample connectivity options for versatile usage.

Package Style (Meter):

GRID ARRAY - Facilitates efficient heat dissipation for improved performance.

Minimum Supply Voltage:

0.698 V - Allows for operation at lower power levels for energy efficiency.

Maximum Operating Temperature:

100 °C - Withstands high temperatures for reliable operation in various environments.

Minimum Operating Temperature:

40 °C - Performs well even in cold conditions for versatility.

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu) - Provides corrosion resistance for extended lifespan.

Terminal Position:

BOTTOM - Simplifies installation and connectivity in systems.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering during assembly for quality connections.

Peak Reflow Temperature °C:

245 - Ideal temperature for secure solder joints in manufacturing processes.

Temperature Grade:

INDUSTRIAL - Suitable for demanding industrial applications.

Peripheral IC Type:

MICROPROCESSOR CIRCUIT - Enhances overall functionality and processing capabilities.

Technology:

CMOS - Offers low power consumption and high noise immunity for efficiency.

Terminal Form:

BALL - Facilitates easy and reliable connections in various setups.

Nominal Supply Voltage:

0.72 V - Maintains stable operation within specified voltage range.

Moisture Sensitivity Level (MSL):

4 - Provides protection against moisture damage for added reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU9EG-L1FFVC900I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

Additional Features:

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU9EG-L1FFVC900I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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