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XCZU7CG-2FFVF1517E

Xilinx

XCZU7CG-2FFVF1517E by Xilinx

XCZU7CG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in surface mount designs.

Median Price

$4,100.748

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VNN

France . 157 parts In-Stock

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Nova Conductors

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AZTECH Wire

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Overview

Unlock the potential of cutting-edge technology with the XCZU7CG-2FFVF1517E by Xilinx. As a leader in the industry, Xilinx delivers top-quality products that exceed expectations. This versatile microprocessor circuit offers endless possibilities for applications in various industries. Experience unparalleled performance and reliability with this innovative solution, providing customers with exceptional value and unmatched benefits. Elevate your projects with the XCZU7CG-2FFVF1517E and stay ahead of the curve in today's fast-paced world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, ideal for applications where weight and cost are critical factors.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes, saving time and labor costs in production.

Maximum Supply Voltage: 0.876 V

The higher maximum supply voltage allows for flexibility in power supply options, accommodating a wider range of operating conditions.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to integrate into circuit designs and ensures efficient use of space on a PCB.

No. of Terminals: 1517

With a high number of terminals, this product offers extensive connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and electrical characteristics, ensuring reliable operation in various environments.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows for use in demanding industrial environments without risk of overheating or performance degradation.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this product can withstand cold conditions, making it suitable for a wide range of applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple metals in terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position enables easier PCB layout and soldering processes, improving overall assembly efficiency.

Maximum Seated Height: 3.51 mm

Low maximum seated height allows for compact and space-saving designs, ideal for applications with size constraints.

Width: 40 mm

Compact width dimension ensures compatibility with standard PCB layouts and facilitates easy integration into existing designs.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes thermal stress on the components, enhancing overall reliability and longevity.

Peak Reflow Temperature °C: 245

High peak reflow temperature allows for efficient soldering processes and ensures strong solder joints for robust performance.

Length: 40 mm

The compact length dimension enables versatility in placement options on a PCB, accommodating various design requirements.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

With a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for high-performance applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient operation and reliable performance.

Terminal Form: BALL

Ball terminal form allows for reliable connections and efficient heat dissipation, contributing to the overall durability and performance of the product.

Nominal Supply Voltage: 0.85 V

The nominal supply voltage is well-matched with the maximum and minimum supply voltages, ensuring consistent and stable operation.

Terminal Pitch: 1 mm

With a small terminal pitch, this product enables high-density mounting on a PCB, maximizing space utilization and design flexibility.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that this product has a moderate sensitivity to moisture, making it suitable for standard storage and handling practices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7CG-2FFVF1517E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.51 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

XCZU7CG-2FFVF1517E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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