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XCZU7EG-2FFVC1156E

Xilinx

XCZU7EG-2FFVC1156E by Xilinx

The Xilinx XCZU7EG-2FFVC1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance processing capabilities in compact form factors.

Median Price

$4,247.940

Lifecycle Status

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In-Stock Inventory

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Nova Conductors

Japan . 100 parts In-Stock

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$4,247.940

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Vyrian

USA . 7,310 parts In-Stock

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Digiode

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Ampacity Inc.

Singapore . 1,446 parts In-Stock

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$9.000

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Semicontronic

India . 562 parts In-Stock

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$16.000

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$15.600

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AZTECH Wire

Italy . 489 parts In-Stock

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$16.337

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One Stop Electronics

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MARBEL Systems

Belgium . 2,348 parts In-Stock

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$51.352

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$49.298

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Modulus Dynamics

Lithuania . 1,655 parts In-Stock

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$53.134

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Texas Native Microelectronics

USA . 309 parts In-Stock

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$59.025

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Kenton Components

USA . 22,810 parts In-Stock

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Corohmni

South Africa . 26 parts In-Stock

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Microchip USA

USA . 1,471 parts In-Stock

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$3,398.736

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Supply Digital

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Corphita

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Vigor

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Qasali Group International

UK . 25 parts In-Stock

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$152.993

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$140.243

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$140.243

Overview

Unleash the power of cutting-edge technology with the XCZU7EG-2FFVC1156E by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that push boundaries and redefine possibilities. This versatile microprocessor circuit is perfect for a wide range of applications, offering unmatched performance and reliability. Experience seamless integration and superior functionality with this innovative solution. Upgrade your projects and stay ahead of the curve with the XCZU7EG-2FFVC1156E from Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and resistant to heat and moisture, providing protection for the integrated circuits inside.

Surface Mount: YES

Surface mount technology allows for easier and more efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 0.876 V

High maximum supply voltage ensures stable and efficient operation of the ICs without risking damage from voltage spikes.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to align and mount the ICs on the circuit board, improving overall assembly process.

No. of Terminals: 1156

High number of terminals provide ample connectivity options and versatility for the ICs to integrate with various components in a circuit.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and electrical performance compared to other package styles, ensuring reliability.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage allows for efficient power consumption and operation, contributing to energy savings and longevity of the product.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows for usage in a wide range of environments without risk of overheating or performance degradation.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for reliable connections and long-term performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more efficient soldering during assembly, improving overall manufacturing process.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and bonding of the ICs to the circuit board, enhancing overall reliability of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7EG-2FFVC1156E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1156

JESD-609 Code:

e1

Length:

35 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.51 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

35 mm

Peripheral IC Type:

Trade Compliance

XCZU7EG-2FFVC1156E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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