Loading...

RECTANGULAR Other Function uPs,uCs & Peripheral ICs 617

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
JN5169-001-M03-2 by NXP Semiconductors

JN5169-001-M03-2

NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 27; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

R-XXMA-N27

21 mm

27

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.6 V

2 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

1.27 mm

UNSPECIFIED

16 mm

MICROPROCESSOR CIRCUIT

CC3220MODSM2MOBR by Texas Instruments

CC3220MODSM2MOBR

Texas Instruments

The Texas Instruments CC3220MODSM2MOBR is a CORTEX-M4 microprocessor with 256 RAM words and 1024000 ROM words. It features 4 ADC channels, 4 timers, and connectivity options like I2C, I2S, SD, SPI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

YES

0

YES

CORTEX-M4

NO

NO

0

FIXED POINT

NO

R-XBCC-B63

e4

20.5 mm

YES

3

2

0

25

2

63

4

8

8

85 Cel

-40 Cel

NO

UNSPECIFIED

BCC

RECTANGULAR

CHIP CARRIER

260

262144

256

1024000

FLASH

2.45 mm

2400 rpm

3.6 V

2.3 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

BUTT

1.27 mm

BOTTOM

30

17.5 mm

MICROPROCESSOR CIRCUIT

0

I2C, I2S, SD, SPI, UART

TIMER(4), WDT

4-Ch 12-Bit

AX-SFUS-1-01-TB05 by Onsemi

AX-SFUS-1-01-TB05

Onsemi

AX-SFUS-1-01-TB05 by Onsemi is a CMOS MICROPROCESSOR CIRCUIT with 40 terminals in a RECTANGULAR CHIP CARRIER package. It operates b/w -40 to 85 °C, with supply voltage range of 1.8V to 3.6V, making it ideal for industrial applications requiring high performance and reliability.

R-XQCC-N40

7 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

AX-SFUS-API-1-01-TB05 by Onsemi

AX-SFUS-API-1-01-TB05

Onsemi

AX-SFUS-API-1-01-TB05 by Onsemi is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.8V to 3.6V, making it ideal for INDUSTRIAL applications requiring high performance in compact spaces.

R-XQCC-N40

7 mm

1

40

85 Cel

-40 Cel

UNSPECIFIED

HVQCCN

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

1 mm

3.6 V

1.8 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD PALLADIUM

NO LEAD

.5 mm

QUAD

30

5 mm

MICROPROCESSOR CIRCUIT

AX-SIP-SFEU-1-01-TX30 by Onsemi

AX-SIP-SFEU-1-01-TX30

Onsemi

AX-SIP-SFEU-1-01-TX30 by Onsemi is a 44-terminal MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -30 to 85 °C, with supply voltage range of 2-3.6 V. Ideal for applications requiring very thin profile and surface mount compatibility.

R-XBCC-B44

9 mm

3

44

85 Cel

-30 Cel

UNSPECIFIED

HVBCC

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.996 mm

3.6 V

2 V

3 V

YES

CMOS

OTHER

NICKEL GOLD PALLADIUM

BUTT

BOTTOM

30

7 mm

MICROPROCESSOR CIRCUIT

AX-SIP-SFEU-API-1-01-TX30 by Onsemi

AX-SIP-SFEU-API-1-01-TX30

Onsemi

AX-SIP-SFEU-API-1-01-TX30 by Onsemi is a 44-terminal microprocessor circuit with CMOS technology. It operates b/w -30 to 85 °C and has a supply voltage range of 2V to 3.6V. This chip carrier is suitable for applications requiring very thin profile ICs.

R-XBCC-B44

9 mm

3

44

85 Cel

-30 Cel

UNSPECIFIED

HVBCC

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

260

.996 mm

3.6 V

2 V

3 V

YES

CMOS

OTHER

NICKEL GOLD PALLADIUM

BUTT

BOTTOM

30

7 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210PB1952 by Microchip Technology

ATWINC1500-MR210PB1952

Microchip Technology

Microchip Technology's ATWINC1500-MR210PB1952 is a CMOS microprocessor circuit with 28 terminals, operating at up to 48 MHz. It has a supply voltage range of 2.7V to 3.6V and can withstand temperatures from -40°C to 80°C. Ideal for industrial applications requiring high clock frequencies in compact designs.

48 MHz

R-XXMA-N28

21.72 mm

28

80 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

TS 16949

2.11 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1510-MR210PB1952 by Microchip Technology

ATWINC1510-MR210PB1952

Microchip Technology

ATWINC1510-MR210PB1952 by Microchip operates at 48 MHz clock frequency, with a supply voltage range of 2.7V to 3.6V. It is an industrial-grade microprocessor circuit suitable for applications requiring high-speed processing in a compact rectangular package style. With TS 16949 screening level, it offers reliable performance in harsh environments with temperatures ranging from -40°C to 80°C.

48 MHz

R-XXMA-N28

21.72 mm

28

80 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TS 16949

2.11 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

XCZU17EG-2FFVB1517E by Xilinx

XCZU17EG-2FFVB1517E

Xilinx

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

XCZU19EG-2FFVB1517E by Xilinx

XCZU19EG-2FFVB1517E

Xilinx

XCZU19EG-2FFVB1517E by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates b/w 0-100°C, with supply voltage ranging from 0.825-0.876 V. This grid array package is ideal for various applications requiring high-performance processing capabilities in electronic systems.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

BOTTOM

30

MICROPROCESSOR CIRCUIT

AX8052F143-2-TB05 by Onsemi

AX8052F143-2-TB05

Onsemi

AX8052F143-2-TB05 by Onsemi is a CMOS System on Chip with 40 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 2.2V to 3.6V and is suitable for industrial applications requiring a very thin profile, heat sink package style. This chip carrier supports surface mount technology and features nickel/palladium/gold terminal finish.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F143-3-TB05 by Onsemi

AX8052F143-3-TB05

Onsemi

AX8052F143-3-TB05 by Onsemi is a 40-terminal IC with max supply voltage of 3.6V and min of 2.2V, operating b/w -40 to 85 °C. It's a CMOS System on Chip suitable for industrial applications requiring very thin profile and quad terminal position.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC28,.35X.55

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

AX8052F131-2-TX30 by Onsemi

AX8052F131-2-TX30

Onsemi

AX8052F131-2-TX30 by Onsemi is a System on Chip with 40 terminals, operating at -40 to 85 °C. It features a supply voltage range of 2.2V to 3.6V and uses CMOS technology. Ideal for industrial applications requiring a compact chip carrier package with very thin profile and heat sink/slug design.

R-PQCC-N40

e4

7 mm

1

40

85 Cel

-40 Cel

PLASTIC/EPOXY

HVQCCN

LCC40,.2X.28,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG

260

1 mm

3.6 V

2.2 V

3 V

YES

CMOS

INDUSTRIAL

Nickel/Palladium/Gold (Ni/Pd/Au)

NO LEAD

.5 mm

QUAD

5 mm

SYSTEM ON CHIP

RN2903A-I/RM098 by Microchip Technology

RN2903A-I/RM098

Microchip Technology

Microchip RN2903A-I/RM098 is a CMOS microprocessor IC with 47 terminals. It operates b/w -40 to 85°C, with supply voltage range of 2.1-3.6V. Ideal for industrial applications requiring TS16949 screening and surface mount compatibility.

R-XXMA-N47

e4

26.67 mm

47

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

250

TS 16949

3.34 mm

3.6 V

2.1 V

3.3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

NO LEAD

1.27 mm

UNSPECIFIED

17.78 mm

MICROPROCESSOR CIRCUIT

ADUCM331WFSBCPZ-RL by Analog Devices

ADUCM331WFSBCPZ-RL

Analog Devices

ADUCM331WFSBCPZ-RL by Analog Devices is a CMOS microprocessor circuit with SPI bus compatibility. It operates b/w -40 to 115 °C and has a supply voltage range of 3.6V to 18V, making it suitable for industrial applications requiring high performance in a compact package. With AEC-Q100 screening level, this chip carrier is ideal for automotive electronics where reliability and durability are crucial.

SPI

S-XQCC-N32

6 mm

32

115 Cel

-40 Cel

UNSPECIFIED

HVQCCN

LCC32,.24SQ,20

RECTANGULAR

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

NOT SPECIFIED

AEC-Q100

1 mm

18 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

QUAD

NOT SPECIFIED

6 mm

MICROPROCESSOR CIRCUIT

XCZU46DR-1FFVH1760E by Xilinx

XCZU46DR-1FFVH1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-1FFVH1760I by Xilinx

XCZU46DR-1FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-1FSVH1760E by Xilinx

XCZU46DR-1FSVH1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-1FSVH1760I by Xilinx

XCZU46DR-1FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-2FFVH1760E by Xilinx

XCZU46DR-2FFVH1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-2FFVH1760I by Xilinx

XCZU46DR-2FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-2FSVH1760E by Xilinx

XCZU46DR-2FSVH1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-2FSVH1760I by Xilinx

XCZU46DR-2FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L1FFVH1760I by Xilinx

XCZU46DR-L1FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L1FSVH1760I by Xilinx

XCZU46DR-L1FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L2FFVH1760I by Xilinx

XCZU46DR-L2FFVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU46DR-L2FSVH1760I by Xilinx

XCZU46DR-L2FSVH1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FFVE1156E by Xilinx

XCZU47DR-1FFVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FFVE1156I by Xilinx

XCZU47DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FFVG1517E by Xilinx

XCZU47DR-1FFVG1517E

Xilinx

XCZU47DR-1FFVG1517E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring Other Function uPs,uCs & Peripheral ICs in a surface-mount GRID ARRAY package.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FFVG1517I by Xilinx

XCZU47DR-1FFVG1517I

Xilinx

XCZU47DR-1FFVG1517I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVE1156E by Xilinx

XCZU47DR-1FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVE1156I by Xilinx

XCZU47DR-1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVG1517E by Xilinx

XCZU47DR-1FSVG1517E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-1FSVG1517I by Xilinx

XCZU47DR-1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVE1156E by Xilinx

XCZU47DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVE1156I by Xilinx

XCZU47DR-2FFVE1156I

Xilinx

The Xilinx XCZU47DR-2FFVE1156I is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 1156 terminals in a grid array package, it's ideal for industrial applications requiring high-performance computing capabilities.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVG1517E by Xilinx

XCZU47DR-2FFVG1517E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FFVG1517I by Xilinx

XCZU47DR-2FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVE1156E by Xilinx

XCZU47DR-2FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVE1156I by Xilinx

XCZU47DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVG1517E by Xilinx

XCZU47DR-2FSVG1517E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-2FSVG1517I by Xilinx

XCZU47DR-2FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FFVE1156I by Xilinx

XCZU47DR-L1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FFVG1517I by Xilinx

XCZU47DR-L1FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FSVE1156I by Xilinx

XCZU47DR-L1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L1FSVG1517I by Xilinx

XCZU47DR-L1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FFVE1156I by Xilinx

XCZU47DR-L2FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC