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RECTANGULAR Other Function uPs,uCs & Peripheral ICs 617

Other Function uPs,uCs & Peripheral ICs
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of Bits No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Ports No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
XCZU47DR-L2FFVG1517I by Xilinx

XCZU47DR-L2FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FSVE1156I by Xilinx

XCZU47DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU47DR-L2FSVG1517I by Xilinx

XCZU47DR-L2FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVE1156E by Xilinx

XCZU48DR-1FFVE1156E

Xilinx

XCZU48DR-1FFVE1156E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for Other Function uPs,uCs & Peripheral ICs applications due to its low supply voltage range of 0.825-0.876 V and high peak reflow temperature of 245C.

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVE1156I by Xilinx

XCZU48DR-1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVG1517E by Xilinx

XCZU48DR-1FFVG1517E

Xilinx

XCZU48DR-1FFVG1517E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for various applications requiring Other Function uPs,uCs & Peripheral ICs in a GRID ARRAY package style.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FFVG1517I by Xilinx

XCZU48DR-1FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVE1156E by Xilinx

XCZU48DR-1FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVE1156I by Xilinx

XCZU48DR-1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVG1517E by Xilinx

XCZU48DR-1FSVG1517E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-1FSVG1517I by Xilinx

XCZU48DR-1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVE1156E by Xilinx

XCZU48DR-2FFVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVE1156I by Xilinx

XCZU48DR-2FFVE1156I

Xilinx

XCZU48DR-2FFVE1156I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. Suitable for industrial applications, it features a grid array package style and 1156 terminals for surface mount assembly.

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVG1517E by Xilinx

XCZU48DR-2FFVG1517E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FFVG1517I by Xilinx

XCZU48DR-2FFVG1517I

Xilinx

XCZU48DR-2FFVG1517I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVE1156E by Xilinx

XCZU48DR-2FSVE1156E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVE1156I by Xilinx

XCZU48DR-2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVG1517E by Xilinx

XCZU48DR-2FSVG1517E

Xilinx

XCZU48DR-2FSVG1517E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It has 1517 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for Other Function uPs,uCs & Peripheral ICs applications.

R-PBGA-B1517

e1

4

1517

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-2FSVG1517I by Xilinx

XCZU48DR-2FSVG1517I

Xilinx

The Xilinx XCZU48DR-2FSVG1517I is a programmable SoC with CMOS technology. It operates in industrial temperature range (-40 to 100 °C) and has a max supply voltage of 0.876 V. With 1517 terminals in a grid array package, it's ideal for various applications requiring high-performance computing and processing capabilities.

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FFVE1156I by Xilinx

XCZU48DR-L1FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FFVG1517I by Xilinx

XCZU48DR-L1FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FSVE1156I by Xilinx

XCZU48DR-L1FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L1FSVG1517I by Xilinx

XCZU48DR-L1FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FFVE1156I by Xilinx

XCZU48DR-L2FFVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FFVG1517I by Xilinx

XCZU48DR-L2FFVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FSVE1156I by Xilinx

XCZU48DR-L2FSVE1156I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1156

e1

4

1156

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU48DR-L2FSVG1517I by Xilinx

XCZU48DR-L2FSVG1517I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1517

e1

4

1517

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-1FFVF1760E by Xilinx

XCZU49DR-1FFVF1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-1FFVF1760I by Xilinx

XCZU49DR-1FFVF1760I

Xilinx

XCZU49DR-1FFVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w -40 to 100 °C. Ideal for industrial applications requiring a supply voltage range of 0.825V to 0.876V.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

PROGRAMMABLE SoC

XCZU49DR-1FSVF1760E by Xilinx

XCZU49DR-1FSVF1760E

Xilinx

XCZU49DR-1FSVF1760E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for Other Function uPs,uCs & Peripheral ICs applications requiring a supply voltage range of 0.825-0.876 V and peak reflow temperature of 240C.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-1FSVF1760I by Xilinx

XCZU49DR-1FSVF1760I

Xilinx

XCZU49DR-1FSVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This IC is ideal for industrial applications requiring high performance and reliability.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FFVF1760E by Xilinx

XCZU49DR-2FFVF1760E

Xilinx

XCZU49DR-2FFVF1760E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for applications requiring low power consumption and high performance.

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FFVF1760I by Xilinx

XCZU49DR-2FFVF1760I

Xilinx

XCZU49DR-2FFVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals, operates b/w -40 to 100 °C, and has a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FSVF1760E by Xilinx

XCZU49DR-2FSVF1760E

Xilinx

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-2FSVF1760I by Xilinx

XCZU49DR-2FSVF1760I

Xilinx

XCZU49DR-2FSVF1760I by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It has 1760 terminals, operates b/w -40 to 100 °C, and supports a supply voltage range of 0.825V to 0.876V. Ideal for industrial applications requiring high-performance computing in a compact form factor.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.876 V

.825 V

.85 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-L1FFVF1760I by Xilinx

XCZU49DR-L1FFVF1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-L1FSVF1760I by Xilinx

XCZU49DR-L1FSVF1760I

Xilinx

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

240

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

XCZU49DR-L2FFVF1760I by Xilinx

XCZU49DR-L2FFVF1760I

Xilinx

The Xilinx XCZU49DR-L2FFVF1760I is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, suitable for industrial applications. Operating temperature ranges from -40 to 100 °C, with supply voltage b/w 0.698V to 0.742V.

R-PBGA-B1760

e1

4

1760

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

.742 V

.698 V

.72 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

PROGRAMMABLE SoC

ST33HTPH2028AAF3 by STMicroelectronics

ST33HTPH2028AAF3

STMicroelectronics

ST33HTPH2028AAF3 by STMicroelectronics is a cryptographic authenticator in a compact 28-terminal SOIC package. It operates b/w -40 °C to 105 °C, with a nominal voltage of 1.8V, making it ideal for industrial applications requiring secure authentication. Its thin profile and gull-wing terminals facilitate easy surface mounting.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

R-PDSO-G28

9.7 mm

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

1.8 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2E28AAF0 by STMicroelectronics

ST33HTPH2E28AAF0

STMicroelectronics

ST33HTPH2E28AAF0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It features a cryptographic authenticator for industrial applications. The small outline package has a thin profile and gull wing terminals, suitable for surface mount assembly at 0.65mm pitch.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

R-PDSO-G28

9.7 mm

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

1.8 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ST33HTPH2E28AAF1 by STMicroelectronics

ST33HTPH2E28AAF1

STMicroelectronics

ST33HTPH2E28AAF1 by STMicroelectronics is a cryptographic authenticator IC with CMOS technology. It operates b/w -40 to 105°C, suitable for industrial applications. This small outline IC has 28 terminals, gull wing form, and a package size of 4.4x9.7 mm for surface mount assembly.

ALSO OPERATES AT 3.3V NOMINAL VOLATGE

R-PDSO-G28

9.7 mm

28

105 Cel

-40 Cel

PLASTIC/EPOXY

TSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

1.2 mm

1.8 V

YES

CMOS

INDUSTRIAL

GULL WING

.65 mm

DUAL

4.4 mm

CRYPTOGRAPHIC AUTHENTICATOR

ATWINC1500-MR210PB1952-T by Microchip Technology

ATWINC1500-MR210PB1952-T

Microchip Technology

Microchip's ATWINC1500-MR210PB1952-T is a CMOS network controller with 28 terminals, operating at 2.7-3.6V, ideal for industrial applications. With a compact rectangular package style and surface mount design, it offers a wide temperature range from -40 to 85°C for versatile use in various electronic systems.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

MODULE28(UNSPEC)

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

1.016 mm

UNSPECIFIED

NOT SPECIFIED

14.73 mm

NETWORK CONTROLLER

SIP007AFS001 by Samsung

SIP007AFS001

Samsung

MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 271; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;

R-XXMA-X271

49 mm

271

70 Cel

0 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

3.45 mm

5 V

3.7 V

4.2 V

NO

CMOS

COMMERCIAL

UNSPECIFIED

1.13 mm

UNSPECIFIED

36 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210PB1172 by Microchip Technology

ATWINC1500-MR210PB1172

Microchip Technology

ATWINC1500-MR210PB1172 by Microchip operates at 2.7-3.6V, with temp range -40 to 85°C. Its MICROELECTRONIC ASSEMBLY style has 28 terminals and CMOS tech for INDUSTRIAL applications in MICROPROCESSOR CIRCUITS.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210PB1944 by Microchip Technology

ATWINC1500-MR210PB1944

Microchip Technology

ATWINC1500-MR210PB1944 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1510-MR210PB1944 by Microchip Technology

ATWINC1510-MR210PB1944

Microchip Technology

Microchip Technology's ATWINC1510-MR210PB1944 is a CMOS microprocessor circuit with 28 terminals. It operates b/w -40 to 85°C, ideal for industrial applications. With a supply voltage range of 2.7V to 3.6V, it offers high performance in compact MICROELECTRONIC ASSEMBLY package style.

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

2.113 mm

3.6 V

2.7 V

3.3 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210PB1140 by Microchip Technology

ATWINC1500-MR210PB1140

Microchip Technology

ATWINC1500-MR210PB1140 by Microchip operates at 3-4.2V, with temp range -40 to 85°C. It's a CMOS microprocessor circuit with 28 terminals, ideal for industrial applications requiring surface mount technology in compact spaces.

SEATED HGT-NOM

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

4.2 V

3 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT

ATWINC1500-MR210UB1140 by Microchip Technology

ATWINC1500-MR210UB1140

Microchip Technology

ATWINC1500-MR210UB1140 by Microchip operates at 3-4.2V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit in a rectangular package style, ideal for industrial applications requiring surface mount technology. With 28 terminals and compact dimensions of 21.72mm x 14.73mm x 2.113mm, it offers high performance in various uP and uC functions.

SEATED HGT-NOM

R-XXMA-N28

21.72 mm

28

85 Cel

-40 Cel

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NOT SPECIFIED

2.113 mm

4.2 V

3 V

3.6 V

YES

CMOS

INDUSTRIAL

NO LEAD

UNSPECIFIED

NOT SPECIFIED

14.73 mm

MICROPROCESSOR CIRCUIT