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XCZU49DR-L2FFVF1760I

Xilinx

XCZU49DR-L2FFVF1760I by Xilinx

The Xilinx XCZU49DR-L2FFVF1760I is a PROGRAMMABLE SoC with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, suitable for industrial applications. Operating temperature ranges from -40 to 100 °C, with supply voltage b/w 0.698V to 0.742V.

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Overview

Unlock the power of cutting-edge technology with the XCZU49DR-L2FFVF1760I by Xilinx. As a leading manufacturer in the industry, Xilinx delivers top-quality products that push boundaries in the field of Other Function uPs,uCs & Peripheral ICs. This programmable SoC offers unparalleled value with its advanced features, making it perfect for a wide range of applications. Experience seamless performance, reliability, and innovation with Xilinx's XCZU49DR-L2FFVF1760I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, which is ideal for portable devices or applications where weight is a concern.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product, saving time and reducing production costs.

Maximum Supply Voltage: 0.742 V

The higher maximum supply voltage ensures that the product can handle a wide range of input voltages, providing flexibility in different operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and easy integration into existing designs or layouts.

No. of Terminals: 1760

Having a high number of terminals allows for more connectivity options, making the product suitable for complex circuit designs or applications that require multiple connections.

Package Style (Meter): GRID ARRAY

The grid array package style provides better thermal performance and improved signal integrity, making it a reliable choice for high-speed and high-frequency applications.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures that the product can operate reliably even in harsh environmental conditions or under heavy loads.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for the product to function in cold environments without any performance issues, increasing its versatility.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent corrosion resistance and ensures stable electrical connections, enhancing the product's reliability and longevity.

Terminal Position: BOTTOM

Having terminals at the bottom makes it easier to solder the product onto a circuit board, improving assembly efficiency and reducing potential risks of damage during the manufacturing process.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for battery-powered devices or applications requiring efficient power management.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that the product has a low sensitivity to moisture, ensuring its reliability and performance consistency in humid or damp environments.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU49DR-L2FFVF1760I attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B1760

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

.742 V

Minimum Supply Voltage:

.698 V

Nominal Supply Voltage:

.72 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

XCZU49DR-L2FFVF1760I Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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