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TNETV6437INZWTQ5

Texas Instruments

TNETV6437INZWTQ5 by Texas Instruments

TNETV6437INZWTQ5 by Texas Instruments is a DSP with 32-bit external data bus, 27 MHz clock frequency, and 13-bit address bus width. Ideal for automotive applications due to its low power mode, CMOS technology, and max operating temperature of 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,273 parts In-Stock

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2,273

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Digiode

USA . 1,467 parts In-Stock

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1,467

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Distributors (Availability)

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One Stop Electronics

USA . 860 parts In-Stock

1+ parts

$4.000

100+ parts

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860

$4.000

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AZTECH Wire

Italy . 333 parts In-Stock

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$13.481

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333

$13.481

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Corohmni

South Africa . 750 parts In-Stock

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$65.987

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750

$65.987

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Parana Technologies

USA . 157 parts In-Stock

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$75.589

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157

$75.589

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DigiPath Technology Company

USA . 1,691 parts In-Stock

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$83.233

100+ parts

$76.575

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1,691

$83.233

$76.575

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IDEA Electronic Components Group

UK . 1,254 parts In-Stock

1+ parts

$84.932

100+ parts

$80.685

1k+ parts

$76.439

10k+ parts

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1,254

$84.932

$80.685

$76.439

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ChromeModa Solutions

Germany . 872 parts In-Stock

1+ parts

$84.932

100+ parts

$69.644

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872

$84.932

$69.644

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Corphita

USA . 784 parts In-Stock

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784

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Overview

Experience superior performance and reliability with the TNETV6437INZWTQ5 by Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor (DSP) offers a wide range of applications, from automotive to consumer electronics. With its cutting-edge technology and low power mode, this product delivers unmatched value and benefits to customers. Trust Texas Instruments for quality and innovation in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.26 V

Allows for efficient power usage while providing enough voltage for optimal performance.

Address Bus Width: 13

Offers sufficient address bus width for handling complex data processing tasks.

Package Shape: SQUARE

Helps in compact packaging and efficient utilization of space on the PCB.

No. of Terminals: 361

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables high-density mounting and efficient heat dissipation for enhanced performance.

Minimum Supply Voltage: 1.14 V

Allows for operation at lower power levels, reducing energy consumption and heat generation.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold conditions without compromising performance.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Facilitates easier PCB layout and assembly, improving overall system design.

Maximum Seated Height: 1.4 mm

Helps in achieving a low-profile design for space-constrained applications.

Width: 16 mm

Compact size allows for easy integration into various electronic devices.

Boundary Scan: YES

Enables efficient testing and debugging of the device during production and in the field.

External Data Bus Width: 32

Provides a wide data bus for high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 27 MHz

Offers fast clock speed for rapid data processing and real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes without damage.

Internal Bus Architecture: MULTIPLE

Enhances data flow and processing efficiency within the chip.

Length: 16 mm

Complements the compact width for a square form factor, optimizing PCB layout.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliable operation in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral support for diverse signal processing applications.

Technology: CMOS

Provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Facilitates reliable and secure connections in the mounting process.

Nominal Supply Voltage: 1.2 V

Well-suited for various applications requiring a stable power supply voltage.

Terminal Pitch: 0.8 mm

Fine pitch spacing enables high-density mounting on PCBs for compact designs.

Format: FIXED POINT

Optimized for fixed-point arithmetic operations in signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Meets industry standards for moisture resistance during manufacturing and storage.

Low Power Mode: YES

Provides power-saving mode for efficient energy management and extended battery life.

Technical Specifications

Digital Signal Processors (DSPs) TNETV6437INZWTQ5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

EMIF 22 ADDRESS AND 8 DATA BUS AVAILABLE

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV6437INZWTQ5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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