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TNETV2667ZWT

Texas Instruments

TNETV2667ZWT by Texas Instruments

TNETV2667ZWT by Texas Instruments is a DSP with 32-bit external data bus width, 30 MHz max clock frequency, and 1.2 V nominal voltage. Ideal for digital signal processing applications requiring low power mode operation in a compact grid array package with bottom terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,968 parts In-Stock

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Digiode

USA . 2,152 parts In-Stock

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2,152

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Distributors (Availability)

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Ampacity Inc.

Singapore . 284 parts In-Stock

1+ parts

$5.000

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284

$5.000

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AZTECH Wire

Italy . 381 parts In-Stock

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$17.955

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381

$17.955

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One Stop Electronics

USA . 1,080 parts In-Stock

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$33.000

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$33.000

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Corohmni

South Africa . 2,893 parts In-Stock

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$49.695

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2,893

$49.695

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Parana Technologies

USA . 2,063 parts In-Stock

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$73.209

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2,063

$73.209

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DigiPath Technology Company

USA . 1,831 parts In-Stock

1+ parts

$80.612

100+ parts

$74.163

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1,831

$80.612

$74.163

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ChromeModa Solutions

Germany . 5,434 parts In-Stock

1+ parts

$82.257

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$67.451

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$82.257

$67.451

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IDEA Electronic Components Group

UK . 2,248 parts In-Stock

1+ parts

$82.257

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$78.144

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$74.031

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2,248

$82.257

$78.144

$74.031

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Corphita

USA . 3,577 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TNETV2667ZWT by Texas Instruments. Crafted with precision and expertise, this Digital Signal Processor offers unparalleled performance and reliability. Whether you're in the automotive, consumer electronics, or industrial automation industry, this product delivers exceptional value and benefits to meet your needs. Trust in Texas Instruments for superior quality and innovative solutions that elevate your applications to new heights. Unlock a world of possibilities with the TNETV2667ZWT and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a low maximum supply voltage range, reducing power consumption and heat generation.

Address Bus Width: 13

Wide address bus width enables efficient and fast data processing, making the product suitable for applications requiring complex calculations.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, making it suitable for compact device designs.

No. of Terminals: 361

High number of terminals provide ample connectivity options, enabling the product to interface with various external components.

Minimum Supply Voltage: 1.14 V

Supports a low minimum supply voltage, ensuring consistent performance even under low power conditions.

Maximum Operating Temperature: 90 °C

Wide maximum operating temperature range ensures reliability in various environmental conditions, making the product versatile for different use cases.

Minimum Operating Temperature: 0 °C

Operates reliably at low temperatures, ensuring functionality in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

High-quality terminal finish enhances connectivity and conductivity, ensuring stable signal transmission for optimal performance.

Width: 16 mm

Compact width size allows for easy integration into space-constrained designs, making the product suitable for compact electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed as a digital signal processor, ensuring efficient signal processing capabilities for audio, video, and other digital signal applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, making the product energy-efficient and responsive.

Format: FIXED POINT

Fixed-point format provides accurate and reliable data processing capabilities, making the product suitable for precision applications.

Low Power Mode: YES

Includes a low power mode option for energy-saving operation, allowing the product to conserve power when not operating at full capacity.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2667ZWT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2667ZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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