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TNETV2666FIDZWT

Texas Instruments

TNETV2666FIDZWT by Texas Instruments

TNETV2666FIDZWT by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at max 30 MHz. Ideal for digital signal processing applications, it features low power mode, CMOS technology, and boundary scan capability. Package style: grid array, low profile, fine pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,474 parts In-Stock

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7,474

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Digiode

USA . 4,079 parts In-Stock

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4,079

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Distributors (Availability)

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AZTECH Wire

Italy . 459 parts In-Stock

1+ parts

$11.168

100+ parts

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459

$11.168

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One Stop Electronics

USA . 208 parts In-Stock

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$23.000

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208

$23.000

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Ampacity Inc.

Singapore . 632 parts In-Stock

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$27.000

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632

$27.000

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Parana Technologies

USA . 1,097 parts In-Stock

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$71.062

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1,097

$71.062

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DigiPath Technology Company

USA . 1,735 parts In-Stock

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$78.248

100+ parts

$71.988

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1,735

$78.248

$71.988

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ChromeModa Solutions

Germany . 5,107 parts In-Stock

1+ parts

$79.845

100+ parts

$65.473

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5,107

$79.845

$65.473

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IDEA Electronic Components Group

UK . 1,334 parts In-Stock

1+ parts

$79.845

100+ parts

$75.853

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$71.860

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1,334

$79.845

$75.853

$71.860

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Corohmni

South Africa . 162 parts In-Stock

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$84.923

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162

$84.923

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QUARKTWIN TECHNOLOGY LTD

USA . 17,155 parts In-Stock

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Corphita

USA . 1,807 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TNETV2666FIDZWT by Texas Instruments, a top-tier manufacturer known for its superior quality and innovation in the field of Digital Signal Processors (DSPs). This product boasts a wide range of applications, from telecommunications to automotive systems, offering customers exceptional value and performance. With advanced features like low power mode and boundary scan capability, this DSP provides unmatched benefits and advantages, making it the ideal choice for your next project. Upgrade your technology game with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly processes, saving time and effort.

Maximum Supply Voltage: 1.26 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs, enhancing its versatility.

Address Bus Width: 13

Having a wide address bus width allows for efficient memory addressing and data processing, improving overall performance.

Package Shape: SQUARE

The square shape of the package helps in the efficient layout and stacking of components on a circuit board, saving space.

No. of Terminals: 361

The high number of terminals enables the DSP to connect to multiple external components, expanding its functionality.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures that the DSP can operate efficiently even with low power input, making it energy-efficient.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this DSP can withstand heat-intensive environments, increasing its durability.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this DSP suitable for a wide range of applications, including industrial and automotive.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections for extended periods.

Terminal Position: BOTTOM

Bottom terminal position simplifies the assembly process and allows for easier PCB design, enhancing the overall usability of the product.

Maximum Seated Height: 1.4 mm

With a low seated height, this DSP can be easily incorporated into compact designs, making it ideal for space-constrained applications.

Width: 16 mm

The compact width of the DSP allows for efficient use of PCB space, enabling the design of smaller and more portable devices.

Boundary Scan: YES

Having boundary scan capability simplifies testing and debugging processes, reducing time and costs during product development.

External Data Bus Width: 32

A wide external data bus width allows for high-speed data transfer and processing, enhancing the overall performance of the DSP.

Maximum Clock Frequency: 30 MHz

With a high maximum clock frequency, this DSP can handle real-time data processing and demanding computational tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

This short reflow time allows for quick and efficient soldering processes, reducing the risk of damage to sensitive components.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and robust connections, improving the overall quality and durability of the product.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data processing capabilities, enabling simultaneous execution of multiple tasks.

Length: 16 mm

The compact length of the DSP allows for flexible placement on a circuit board, enhancing design options and overall versatility.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This versatile peripheral IC type allows for integration with various external components, expanding the functionality of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form simplifies the mounting process and ensures secure connections, enhancing the overall durability of the product.

Nominal Supply Voltage: 1.2 V

Having a stable nominal supply voltage ensures consistent performance and reliability, making this DSP suitable for long-term operation.

Terminal Pitch: 0.8 mm

With a narrow terminal pitch, this DSP allows for high-density mounting, enabling compact PCB designs and space-saving solutions.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency, making this DSP ideal for high-speed signal processing.

Moisture Sensitivity Level (MSL): 3

Having a moderate moisture sensitivity level ensures that this DSP can withstand typical environmental conditions, maintaining its reliability.

Low Power Mode: YES

The low power mode option allows for efficient power management, extending battery life and reducing energy consumption during idle periods.

Technical Specifications

Digital Signal Processors (DSPs) TNETV2666FIDZWT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TNETV2666FIDZWT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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