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TMS27C210A-15JL

Texas Instruments

TMS27C210A-15JL by Texas Instruments

TMS27C210A-15JL by Texas Instruments is a 64KX16 EPROM with 150ns access time, operating at 5V. It features 3-STATE output characteristics and uses CMOS technology. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.

Median Price

$4.450

Lifecycle Status

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American Microsemiconductor Inc.

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Digiode

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SIE Connect GmbH - GreenChips

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J & M Industries LLC

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Vyrian

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Pegasus Components GmbH

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GES GmbH

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Electronics Depot

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Q Components

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Electronic Expediters

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ComSIT Distribution GmbH

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Corel Iberica Componentes, S.L.

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Holdelec - ElecDif-Pro

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Prism Electronics

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MRC Electronics

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Parana Technologies

USA . 862 parts In-Stock

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 3,724 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

Italy . 265 parts In-Stock

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One Stop Electronics

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A-Z Elektronik GmbH

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Corphita

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Assy Fe

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the TMS27C210A-15JL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality EPROM products that provide reliable performance and versatility. Ideal for a wide range of applications, this EPROM offers customers seamless operation and efficient data storage solutions. Trust Texas Instruments to bring you the best in innovative technology with the TMS27C210A-15JL.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the EPROM, making it suitable for harsh environments.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent operation without the need for a clock signal, providing flexibility and ease of integration into various systems.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to interface with other components in a system.

Technology: CMOS

The CMOS technology offers low power consumption, fast operation, and high noise immunity, making the EPROM efficient and reliable for data storage and retrieval.

No. of Words: 65536 words

With a large number of words for data storage, the EPROM provides ample capacity for storing and retrieving information in embedded systems or electronic devices.

Technical Specifications

EPROM TMS27C210A-15JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T40

Length:

52.07 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.91 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C210A-15JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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