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5962-8765004LA

STMicroelectronics

5962-8765004LA by STMicroelectronics

5962-8765004LA by STMicroelectronics is a military-grade EPROM with a max temp of 125 °C and operates asynchronously. It features a 5V supply, 2048 words (2Kx8) organization, and offers fast access time of 45 ns. Ideal for reliable data storage in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 2,293 parts In-Stock

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Anansix

USA . 1,859 parts In-Stock

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Vyrian

USA . 183 parts In-Stock

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PC Components Company LLC

USA . 20 parts In-Stock

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Bristol Electronics

USA . 20 parts In-Stock

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IDEA Electronic Components Group

UK . 432 parts In-Stock

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$3.417

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$3.075

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MKK Technologies

India . 497 parts In-Stock

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$6.425

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DigiPath Technology Company

USA . 497 parts In-Stock

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$6.425

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$6.425

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Corphita

USA . 3,683 parts In-Stock

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Northwest PG Solutions

USA . 1,873 parts In-Stock

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Parana Technologies

USA . 1,360 parts In-Stock

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Native Components

USA . 466 parts In-Stock

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Overview

Unlock the potential of your projects with the 5962-8765004LA EPROM from STMicroelectronics, a trusted leader in high-quality semiconductor solutions. Designed for military-grade applications, this robust device ensures reliability in extreme conditions, delivering superior performance and longevity. Benefit from its asynchronous operation and versatile compatibility, making it the ideal choice for aerospace, defense, and industrial systems. Elevate your designs with confidence!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The durable ceramic and glass-sealed packaging provides enhanced reliability and protection against environmental factors, making this EPROM suitable for harsh conditions.

Screening Level: 38535Q/M;38534H;883B

This high screening level indicates rigorous testing procedures, ensuring that the product meets military and aerospace standards, enhancing its reliability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space, making it easier to integrate into various electronic designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies the timing requirements for interface with other logic circuits, making it adaptable for a range of applications.

Input/Output Type: COMMON

The common I/O type simplifies the design of communication between multiple components, enhancing the product's versatility.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage suited for many applications, this EPROM ensures stability and ease of integration into existing systems.

Power Supplies (V): 5

Standard power supply of 5V compatibility allows for straightforward adoption in most electronic applications.

No. of Terminals: 24

The availability of 24 terminals facilitates a substantial amount of connectivity options, providing flexibility in design.

Package Style (Meter): IN-LINE, WINDOW

The in-line, windowed package style enables easy access for programming and reprogramming, making it user-friendly.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and functionality in high-temperature environments.

Organization: 2KX8

With a memory organization of 2Kx8, this EPROM is well-suited for a variety of applications where moderate data storage is required.

Output Characteristics: 3-STATE

3-state output allows for multiple devices to share the same output line, adding flexibility to circuit designs.

Minimum Operating Temperature: -55 °C

Capable of operating at extremely low temperatures, this feature allows it to function in a wide range of environmental conditions.

Terminal Finish: TIN LEAD

Tin lead finish enhances solderability and provides a reliable connection when mounted on PCBs.

Terminal Position: DUAL

Dual terminal positioning provides ease of installation and connection to circuit boards, increasing compatibility.

Maximum Seated Height: 5.08 mm

Low profile helps in compact designs, allowing it to fit in space-constrained applications.

Width: 7.62 mm

This width is optimized for most applications, balancing size with performance.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V adds flexibility, enabling operation in systems with slightly varying power specifications.

Length: 32.005 mm

The specific length assures compatibility with standard footprints in electronic assembly.

Programming Voltage (V): 13.5

A programming voltage of 13.5V allows for efficient writing of data, suitable for varied programming situations.

Temperature Grade: MILITARY

Designed for military applications, it guarantees high reliability and performance under demanding conditions.

Technology: CMOS

Being CMOS technology provides low power consumption and high-speed operation, making it energy-efficient.

Parallel or Serial: PARALLEL

Parallel data access allows for faster data throughput, beneficial in applications requiring quick read/write cycles.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical strength and makes it easier to solder onto PCBs.

Maximum Supply Current: 120 mA

The current capabilities ensure that the EPROM can handle robust operation without exceeding power budgets in circuits.

No. of Words: 2048 words

With a capacity of 2048 words, the device is suitable for applications requiring substantial data storage.

Memory Width: 8

An 8-bit memory width is ideal for most applications, providing a good balance between performance and storage.

Terminal Pitch: 2.54 mm

Standard 2.54 mm pitch facilitates easier component placement and soldering in various PCB designs.

No. of Words Code: 2K

The 2K word code storage capacity is efficient for applications such as firmware storage and configuration settings.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage ensures long-term stability and protects the device from overvoltage conditions.

Memory Density: 16384 bit

The high memory density allows for dense data storage solutions, beneficial in compact electronic applications.

Memory IC Type: UVPROM

As a UVPROM, it offers erasable programming, providing flexibility for applications needing frequent updates.

Maximum Standby Current: 0.12 Amp

Low standby current consumption is advantageous for power-sensitive applications, extending battery life in portable devices.

Maximum Access Time: 45 ns

A maximum access time of 45 ns ensures quick data retrieval, making it suitable for high-speed applications.

Technical Specifications

EPROM 5962-8765004LA attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T24

JESD-609 Code:

e0

Length:

32.005 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

13.5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Maximum Standby Current:

.12 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8765004LA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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