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5962-8765004KX

STMicroelectronics

5962-8765004KX by STMicroelectronics

5962-8765004KX by STMicroelectronics is a military-grade EPROM with a ceramic, glass-sealed package. It operates asynchronously at 5V, featuring a max temp of 125 °C and 2048 words (2Kx8) organization. Ideal for reliable data storage in harsh environments.

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5962-8765004KX by STMicroelectronics
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Digiode

USA . 2,951 parts In-Stock

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Anansix

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Vyrian

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IDEA Electronic Components Group

UK . 1,600 parts In-Stock

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$3.269

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$2.942

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MKK Technologies

India . 1,005 parts In-Stock

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$6.147

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DigiPath Technology Company

USA . 1,005 parts In-Stock

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$6.147

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Corphita

USA . 4,071 parts In-Stock

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Parana Technologies

USA . 607 parts In-Stock

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$3.908

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Northwest PG Solutions

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Native Components

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Overview

Unlock unparalleled reliability and performance with the 5962-8765004KX EPROM from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics ensures this ceramic, glass-sealed memory solution meets strict military standards, making it perfect for defense and aerospace applications where durability is crucial. Experience exceptional operational efficiency in extreme temperatures, providing secure data retention and rapid access times—elevate your projects with confidence!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed construction provides excellent protection against environmental factors, making it suitable for high-reliability applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier automation in manufacturing processes.

Screening Level: MIL-STD-883

Meets military standards for reliability and performance, ensuring high quality and durability in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on PCBs, facilitating efficient layout designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies interfacing with other devices, making integration easier in various applications.

Nominal Supply Voltage / Vsup: 5 V

5 V operation aligns with standard logic levels for compatibility with a wide range of existing systems.

No. of Terminals: 24

With 24 terminals, it offers sufficient connectivity options for various applications while maintaining a compact footprint.

Package Style (Meter): FLATPACK

Flatpack design allows for low-profile installations, beneficial in space-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliable operation in high-heat environments.

Organization: 2KX8

This memory organization provides efficient data storage and retrieval, suitable for various digital applications.

Minimum Operating Temperature: -55 °C

Capability to operate in extremely low temperatures makes it ideal for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity and flexibility in PCB layout design.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum voltage ensures compatibility with a wide range of power supply scenarios.

Temperature Grade: MILITARY

Designed to meet military temperature grades, ensuring reliability and durability in critical environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient and reliable.

Parallel or Serial: PARALLEL

Parallel data access allows for faster data transfer rates, enhancing overall performance.

Terminal Form: FLAT

Flat terminal form reduces resistance and enhances electrical performance.

No. of Words: 2048 words

With 2048 words of storage capacity, it is versatile enough for various applications requiring moderate memory.

Memory Width: 8

An 8-bit memory width allows for efficient data handling and integration into 8-bit systems.

No. of Words Code: 2K

The 2K words code provides a good balance between storage capacity and performance for many applications.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a higher supply voltage up to 5.5 V, offering flexibility in power supply design.

Memory Density: 16384 bit

A memory density of 16K bits allows for effective storage of necessary data in various applications.

Memory IC Type: UVPROM

As a UVPROM, it allows for erasure and reprogramming with UV light, useful in prototyping and reconfiguration.

Maximum Access Time: 45 ns

A maximum access time of 45 ns ensures quick data retrieval, enhancing system performance.

Technical Specifications

EPROM 5962-8765004KX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-GDFP-F24

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

2KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

FLAT

Terminal Position:

DUAL

Trade Compliance

5962-8765004KX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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