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5962-8606306XX

STMicroelectronics

5962-8606306XX by STMicroelectronics

5962-8606306XX by STMicroelectronics is a military-grade EPROM with a 32K x 8 organization, operating asynchronously at a nominal voltage of 5V. It features a ceramic, glass-sealed package and supports temperatures from -55 °C to 125 °C. Ideal for reliable data storage in harsh environments.

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1k+

5962-8606306XX by STMicroelectronics
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Digiode

USA . 3,171 parts In-Stock

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3,171

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Anansix

USA . 845 parts In-Stock

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845

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Vyrian

USA . 462 parts In-Stock

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462

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IDEA Electronic Components Group

UK . 1,786 parts In-Stock

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$3.823

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-

1k+ parts

$3.440

10k+ parts

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1,786

$3.823

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$3.440

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MKK Technologies

India . 1,585 parts In-Stock

1+ parts

$7.188

100+ parts

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1,585

$7.188

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DigiPath Technology Company

USA . 1,585 parts In-Stock

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$7.188

100+ parts

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1,585

$7.188

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Corphita

USA . 4,517 parts In-Stock

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4,517

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Supply Digital

USA . 2,557 parts In-Stock

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2,557

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Northwest PG Solutions

USA . 1,402 parts In-Stock

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$3.254

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1,402

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$3.254

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Parana Technologies

USA . 888 parts In-Stock

1+ parts

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100+ parts

$4.570

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888

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$4.570

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Native Components

USA . 646 parts In-Stock

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$3.220

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646

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$3.220

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Overview

Unlock the potential of your projects with the 5962-8606306XX EPROM from STMicroelectronics, a trusted leader in semiconductor technology. This high-quality, military-grade component ensures reliability in extreme conditions, making it perfect for aerospace, defense, and industrial applications. Enjoy exceptional performance with its robust design, offering durability and longevity that translate into value and peace of mind for your critical systems. Elevate your designs with a partner you can count on!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package provides excellent protection against environmental factors, ensuring durability and reliability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of circuit board space and simplifies direct PCB mounting.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler control logic, making integration into existing systems easier.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V is standard, making it compatible with a wide range of applications and systems.

No. of Terminals: 28

With 28 terminals, this component offers sufficient connectivity options for various circuits and configurations.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window package style is ideal for UV erasure, facilitating easy reprogramming of the EPROM.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures the EPROM can function in demanding environments without failure.

Organization: 32KX8

The organization of 32K words of 8 bits provides a balanced architecture for performance and flexibility in data storage.

Minimum Operating Temperature: -55 °C

With a wide operating temperature range down to -55 °C, this EPROM is suited for military and industrial applications that require resilience.

Terminal Finish: TIN LEAD

The tin-lead terminal finish ensures good solderability and reliable electrical connections.

Terminal Position: DUAL

The dual terminal position design simplifies PCB layout and enhances ease of installation.

Maximum Seated Height: 5.588 mm

A maximum seated height of 5.588 mm allows for integration into compact designs while maintaining electrical performance.

Width: 15.24 mm

At 15.24 mm wide, the EPROM fits well within standard PCB constraints for efficient design implementations.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5 V gives flexibility in power supply options for various applications.

Length: 37.1475 mm

The length of 37.1475 mm is compatible with various PCB layouts, facilitating ease of assembly.

Temperature Grade: MILITARY

Designed to meet military specifications, ensuring high performance and reliability under extreme conditions.

Technology: CMOS

The use of CMOS technology allows for low power consumption while maintaining high-speed operation.

Parallel or Serial: PARALLEL

This EPROM operates in parallel mode, allowing for faster data access and retrieval compared to serial configurations.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides robust mechanical support and is preferable for many traditional PCB designs.

No. of Words: 32768 words

With 32,768 words of data capacity, it provides ample storage for a variety of applications.

Memory Width: 8

An 8-bit memory width enables efficient data handling and processing, suited for numerous applications.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard, making the EPROM compatible with many existing PCBs.

No. of Words Code: 32K

With a coding capacity of 32K words, it is ideal for applications requiring substantial data storage.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides headroom for power supply variations, enhancing reliability.

Memory Density: 262144 bit

The memory density of 262,144 bits ensures a compact yet sufficient data storage capacity for diverse applications.

Memory IC Type: UVPROM

As a UVPROM, this EPROM can be erased and reprogrammed easily, offering flexibility for developers.

Maximum Access Time: 120 ns

With a maximum access time of 120 ns, this EPROM provides fast data retrieval, suitable for high-speed applications.

Technical Specifications

EPROM 5962-8606306XX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

120 ns

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Length:

37.1475 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.588 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8606306XX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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