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SM32C6711DGDPA16EP

Texas Instruments

SM32C6711DGDPA16EP by Texas Instruments

Texas Instruments SM32C6711DGDPA16EP is a 32-bit DSP with integrated cache, 166.67 MHz clock frequency, and 4096 RAM words. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include boundary scan, multiple internal bus architecture, and 22-bit address bus width.

Median Price

$36.740

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9 parts In-Stock

1+ parts

$36.740

100+ parts

$34.540

1k+ parts

$31.230

10k+ parts

-

9

$36.740

$34.540

$31.230

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,657 parts In-Stock

1+ parts

$34.903

100+ parts

-

1k+ parts

-

10k+ parts

-

3,657

$34.903

-

-

-

DigiKey Marketplace

USA . 9 parts In-Stock

1+ parts

$36.390

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$36.390

-

-

-

Vyrian

USA . 5,887 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,887

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 146 parts In-Stock

1+ parts

$9.280

100+ parts

-

1k+ parts

-

10k+ parts

-

146

$9.280

-

-

-

Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

$19.884

100+ parts

-

1k+ parts

$19.838

10k+ parts

-

2,050

$19.884

-

$19.838

-

DigiPath Technology Company

USA . 1,705 parts In-Stock

1+ parts

$21.895

100+ parts

$20.144

1k+ parts

-

10k+ parts

-

1,705

$21.895

$20.144

-

-

ChromeModa Solutions

Germany . 4,544 parts In-Stock

1+ parts

$22.342

100+ parts

$18.320

1k+ parts

-

10k+ parts

-

4,544

$22.342

$18.320

-

-

IDEA Electronic Components Group

UK . 1,172 parts In-Stock

1+ parts

$22.342

100+ parts

$21.225

1k+ parts

$20.108

10k+ parts

-

1,172

$22.342

$21.225

$20.108

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Microchip USA

USA . 1,780 parts In-Stock

1+ parts

$25.480

100+ parts

$25.120

1k+ parts

$24.940

10k+ parts

$24.760

1,780

$25.480

$25.120

$24.940

$24.760

Corphita

USA . 4,971 parts In-Stock

1+ parts

$33.066

100+ parts

-

1k+ parts

-

10k+ parts

-

4,971

$33.066

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-

-

Corohmni

South Africa . 2,180 parts In-Stock

1+ parts

$37.863

100+ parts

-

1k+ parts

-

10k+ parts

-

2,180

$37.863

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-

-

Perfect Parts

USA . 32 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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32

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Overview

Experience the power of cutting-edge technology with the SM32C6711DGDPA16EP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that are versatile and reliable. This DSP is perfect for a wide range of applications, providing fast processing speeds and efficient performance. With integrated cache, low power mode, and boundary scan capabilities, this product offers unmatched value and benefits to customers. Upgrade your projects with the SM32C6711DGDPA16EP and elevate your results to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to external elements, making the product long-lasting and reliable.

Integrated Cache: YES

Integrated cache helps in faster data access and processing, improving the overall performance of the digital signal processor.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for efficient power utilization and reliable operation of the DSP.

Address Bus Width: 22

A wider address bus width enables the processor to access a larger memory space, enhancing its capability to handle complex algorithms and tasks.

Bit Size: 32

32-bit architecture allows for high-speed processing and accuracy in calculations, making it suitable for demanding signal processing applications.

No. of Terminals: 272

Having a high number of terminals provides flexibility in connecting external components and peripherals, expanding the functionality of the DSP.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the DSP can function efficiently in harsh environmental conditions without any performance degradation.

RAM Words: 4096

Large RAM capacity allows for storing and accessing a significant amount of data and instructions, improving the speed and efficiency of signal processing tasks.

Maximum Clock Frequency: 166.67 MHz

High maximum clock frequency enables faster data processing and algorithm execution, making the DSP suitable for real-time applications.

Technical Specifications

Digital Signal Processors (DSPs) SM32C6711DGDPA16EP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

166.67 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

SM32C6711DGDPA16EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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