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OMAPL138BZWTA4

Texas Instruments

OMAPL138BZWTA4 by Texas Instruments

The Texas Instruments OMAPL138BZWTA4 is a DSP with max clock freq of 456MHz, operating temp range -40 to 105°C, and low power mode. Ideal for industrial applications requiring high processing speeds in a compact package. Features boundary scan, CMOS tech, and floating point format for efficient signal processing.

Median Price

$35.970

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,070 parts In-Stock

1+ parts

$35.970

100+ parts

$35.250

1k+ parts

$34.530

10k+ parts

-

2,070

$35.970

$35.250

$34.530

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,528 parts In-Stock

1+ parts

$34.172

100+ parts

-

1k+ parts

-

10k+ parts

-

2,528

$34.172

-

-

-

Vyrian

USA . 6,046 parts In-Stock

1+ parts

-

100+ parts

-

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6,046

-

-

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ComSIT Distribution GmbH

Germany . 26 parts In-Stock

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-

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26

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 141 parts In-Stock

1+ parts

$13.530

100+ parts

-

1k+ parts

-

10k+ parts

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141

$13.530

-

-

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Corohmni

South Africa . 135 parts In-Stock

1+ parts

$19.070

100+ parts

-

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135

$19.070

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Corphita

USA . 3,198 parts In-Stock

1+ parts

$32.373

100+ parts

-

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3,198

$32.373

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Parana Technologies

USA . 536 parts In-Stock

1+ parts

$42.109

100+ parts

-

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536

$42.109

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DigiPath Technology Company

USA . 672 parts In-Stock

1+ parts

$46.368

100+ parts

$42.658

1k+ parts

-

10k+ parts

-

672

$46.368

$42.658

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ChromeModa Solutions

Germany . 1,909 parts In-Stock

1+ parts

$47.314

100+ parts

$38.797

1k+ parts

-

10k+ parts

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1,909

$47.314

$38.797

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IDEA Electronic Components Group

UK . 1,004 parts In-Stock

1+ parts

$47.314

100+ parts

$44.948

1k+ parts

$42.583

10k+ parts

-

1,004

$47.314

$44.948

$42.583

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Microchip USA

USA . 227 parts In-Stock

1+ parts

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100+ parts

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227

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Overview

Unlock the power of advanced digital signal processing with the OMAPL138BZWTA4 by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers cutting-edge technology in a compact package that is perfect for a variety of applications. Whether you're in need of low-power mode capabilities or high-speed performance, this product offers unmatched value and benefits to customers looking to elevate their designs to the next level. Experience the advantages of Texas Instruments DSPs and take your project to new heights with the OMAPL138BZWTA4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components of the DSP, making it a reliable choice for long-term use.

Surface Mount: YES

This feature allows for easy and efficient installation of the DSP onto a circuit board, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power management, ensuring the DSP can handle a wide range of power inputs.

Package Shape: SQUARE

The square shape of the package provides a compact and space-saving design, making it suitable for integration into various devices and systems.

No. of Terminals: 361

The high number of terminals allows for a wide range of input and output connections, enhancing the versatility and connectivity of the DSP.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient heat dissipation and electrical performance, ensuring optimal functioning of the DSP in various operating conditions.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency of the DSP, making it a cost-effective choice for long-term operation.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature tolerance ensures reliable performance of the DSP even in challenging environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for the DSP to function effectively in extreme cold environments, offering versatility in usage across different climates.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and resistance to corrosion, ensuring stable and reliable electrical connections for the DSP.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy installation and maintenance of the DSP, enhancing user convenience and accessibility during circuit board assembly.

Boundary Scan: YES

The boundary scan feature allows for efficient debugging and testing of the DSP, ensuring accurate operation and troubleshooting for enhanced reliability.

Maximum Clock Frequency: 456 MHz

The high maximum clock frequency enables fast processing and data handling capabilities of the DSP, making it suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature minimizes the risk of thermal damage to the DSP during manufacturing processes, ensuring product longevity and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and reworking of the DSP onto circuit boards, ensuring secure and durable connections.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data throughput and processing efficiency of the DSP, enabling high-performance signal processing tasks with optimal speed and accuracy.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates robustness and reliability of the DSP for operation in harsh industrial environments, ensuring consistent performance under demanding conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type suggests a versatile and adaptable design of the DSP, allowing integration with various digital signal processing applications and systems for diverse functionality.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed performance for the DSP, making it energy-efficient and suitable for battery-operated devices or power-sensitive applications.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections for the DSP, ensuring stable data transmission and electrical performance for consistent signal processing tasks.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage specification ensures compatibility with standard power sources and enables efficient power management for stable and reliable operation of the DSP.

Format: FLOATING POINT

The floating-point format enhances precision and accuracy of numerical computations in the DSP, enabling complex mathematical operations with high resolution and minimal errors.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level indicates resistance to moisture damage and ensures long-term reliability of the DSP in humid or damp environments, making it suitable for various conditions.

Low Power Mode: YES

The low power mode feature allows for energy-saving operation of the DSP, extending battery life and reducing overall power consumption for enhanced efficiency and cost-effectiveness.

Technical Specifications

Digital Signal Processors (DSPs) OMAPL138BZWTA4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3 V AND 1.8 V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

456 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

OMAPL138BZWTA4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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