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OMAP5912ZVL

Texas Instruments

OMAP5912ZVL by Texas Instruments

OMAP5912ZVL by Texas Instruments is a 16-bit DSP with integrated cache, 26-bit address bus, and 16-bit external data bus. It is used in industrial applications for digital signal processing tasks due to its low power mode, max clock frequency of 19.2 MHz, and multiple internal bus architecture.

Median Price

$58.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 40 parts In-Stock

1+ parts

$58.000

100+ parts

$40.930

1k+ parts

-

10k+ parts

-

40

$58.000

$40.930

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,344 parts In-Stock

1+ parts

$44.365

100+ parts

-

1k+ parts

-

10k+ parts

-

4,344

$44.365

-

-

-

Vyrian

USA . 3,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,877

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,088 parts In-Stock

1+ parts

$31.626

100+ parts

-

1k+ parts

-

10k+ parts

-

5,088

$31.626

-

-

-

Corphita

USA . 4,940 parts In-Stock

1+ parts

$42.030

100+ parts

-

1k+ parts

-

10k+ parts

-

4,940

$42.030

-

-

-

Parana Technologies

USA . 897 parts In-Stock

1+ parts

$67.107

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$67.107

-

-

-

ChromeModa Solutions

Germany . 5,789 parts In-Stock

1+ parts

$75.401

100+ parts

$61.829

1k+ parts

-

10k+ parts

-

5,789

$75.401

$61.829

-

-

IDEA Electronic Components Group

UK . 1,065 parts In-Stock

1+ parts

$75.401

100+ parts

$71.631

1k+ parts

$67.861

10k+ parts

-

1,065

$75.401

$71.631

$67.861

-

DigiPath Technology Company

USA . 236 parts In-Stock

1+ parts

-

100+ parts

$67.982

1k+ parts

-

10k+ parts

-

236

-

$67.982

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-

Overview

Experience unparalleled performance with the OMAP5912ZVL by Texas Instruments, a leading manufacturer of Digital Signal Processors (DSPs). This innovative product offers integrated cache, boundary scan capabilities, and a wide range of applications in the digital processing realm. With a focus on quality and reliability, Texas Instruments delivers a product that exceeds expectations in terms of value and benefits. Whether you're looking to optimize your industrial processes or enhance your communication systems, the OMAP5912ZVL is the perfect solution for all your DSP needs. Elevate your projects with the superior technology and expertise of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP

Integrated Cache: YES

Enhances processing speed and efficiency by storing frequently accessed data

On Chip Data RAM Width: 16

Allows for fast data processing and manipulation directly on the chip

Address Bus Width: 26

Supports large memory addressing capabilities for complex applications

Maximum Clock Frequency: 19.2 MHz

Enables high-speed operation and real-time processing of digital signals

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Suitable for a wide range of signal processing applications, including audio, video, and communications

Technical Specifications

Digital Signal Processors (DSPs) OMAP5912ZVL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

26

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

19.2 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of Terminals:

289

No. of Timers:

15

On Chip Data RAM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

81920

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

192 rpm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP5912ZVL Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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