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DSPIC33CK256MP502T-I/SS

Microchip Technology

DSPIC33CK256MP502T-I/SS by Microchip Technology

DSPIC33CK256MP502T-I/SS by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 64 MHz. It features 24576 RAM words, 4 external interrupts, and operates in an industrial temperature range. Ideal for applications requiring high-speed processing and low power consumption.

Median Price

$2.110

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,100 parts In-Stock

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$2.110

100+ parts

$1.740

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$1.740

2,100

$2.110

$1.740

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$1.740

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$3.612

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650

$3.612

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Vyrian

USA . 1,896 parts In-Stock

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1,896

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Continental Prestige Electronics

USA . 2,478 parts In-Stock

1+ parts

$3.612

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$3.540

2,478

$3.612

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$3.540

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.612

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$3.540

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2,000

$3.612

$3.540

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Argo Parts USA

USA . 1,563 parts In-Stock

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$3.612

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1,563

$3.612

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Corohmni

South Africa . 335 parts In-Stock

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$59.617

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335

$59.617

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QUARKTWIN TECHNOLOGY LTD

USA . 20,094 parts In-Stock

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Lixinc

USA . 10,289 parts In-Stock

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Marpe Global Electronics

Taiwan . 4,778 parts In-Stock

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QualityLine Systems

Poland . 4,106 parts In-Stock

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XL Components Corporation

Australia . 3,113 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the Microchip Technology DSPIC33CK256MP502T-I/SS. Crafted by a leading manufacturer in the industry, this cutting-edge digital signal processor offers unmatched performance and reliability for a wide range of applications. Whether you are designing industrial control systems or embedded motor control solutions, this compact yet powerful device delivers exceptional value, efficiency, and flexibility. Experience seamless integration, superior functionality, and enhanced productivity with the DSPIC33CK256MP502T-I/SS from Microchip Technology. Elevate your projects to the next level with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the DSP.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs.

On Chip Data RAM Width: 8

The wide on-chip data RAM width allows for fast and efficient data processing.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this DSP into various systems and designs.

Bit Size: 16

The 16-bit size ensures high processing accuracy and performance.

No. of Terminals: 28

With a sufficient number of terminals, this DSP can easily connect to other components in a system.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space and allows for compact system design.

Minimum Supply Voltage: 3 V

The low minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions.

No. of External Interrupts: 4

The 4 external interrupts provide flexibility in handling external events and tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in cold environments.

Terminal Position: DUAL

The dual terminal position offers flexibility in connection and integration.

Maximum Seated Height: 2 mm

The low maximum seated height allows for compact and thin designs.

RAM Words: 24576

With a large number of RAM words, this DSP can handle extensive data processing tasks.

Width: 5.3 mm

The small width of this DSP enables easy integration into tight spaces.

Boundary Scan: YES

The boundary scan feature aids in testing and debugging the DSP during development and maintenance.

Maximum Clock Frequency: 64 MHz

The high maximum clock frequency allows for fast signal processing.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow efficiency.

Length: 10.2 mm

The compact length of this DSP is suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The combination of DSP and controller functionalities expands the capabilities of this product.

No. of Timers: 2

The two timers enable time-based operations and scheduling within the DSP.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering and mounting process.

Maximum Supply Current: 35 mA

With a low maximum supply current, this DSP efficiently utilizes power.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and consistent performance.

No. of DMA Channels: 4

The 4 DMA channels enhance data transfer efficiency and speed.

No. of Serial I/Os: 4

The 4 serial I/Os allow for communication with external devices and peripherals.

ROM Programmability: FLASH

The flash ROM programmability enables easy and quick updates to the DSP's firmware.

Terminal Pitch: 0.65 mm

The small terminal pitch contributes to the compact size and high-density layout.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computation accuracy.

Low Power Mode: YES

The low power mode option helps in reducing power consumption during idle or low-activity periods.

Barrel Shifter: YES

The barrel shifter feature facilitates efficient bitwise operations and shifting.

On Chip Program ROM Width: 24

The wide on-chip program ROM width accommodates large program sizes and instructions.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK256MP502T-I/SS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

4

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

RAM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

2 mm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

DSPIC33CK256MP502T-I/SS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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