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MSP430F67771IPZR

Texas Instruments

MSP430F67771IPZR by Texas Instruments

MSP430F67771IPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32768 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high performance in a compact FLATPACK package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,824 parts In-Stock

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Digiode

USA . 2,103 parts In-Stock

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2,103

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AZTECH Wire

Italy . 1,267 parts In-Stock

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$5.927

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$5.927

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One Stop Electronics

USA . 810 parts In-Stock

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$15.000

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810

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Corohmni

South Africa . 4,912 parts In-Stock

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$46.306

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Parana Technologies

USA . 1,566 parts In-Stock

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$50.507

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DigiPath Technology Company

USA . 541 parts In-Stock

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$55.614

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541

$55.614

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IDEA Electronic Components Group

UK . 2,313 parts In-Stock

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$56.749

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$53.912

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$51.074

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2,313

$56.749

$53.912

$51.074

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ChromeModa Solutions

Germany . 1,997 parts In-Stock

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$56.749

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$46.534

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Corphita

USA . 1,945 parts In-Stock

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Microchip USA

USA . 144 parts In-Stock

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Overview

Unlock the potential of your next project with the Texas Instruments MSP430F67771IPZR. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this versatile microprocessor circuit. Whether you're working on industrial automation, consumer electronics, or IoT devices, the MSP430F67771IPZR offers unmatched performance and efficiency. With its advanced features and innovative design, this microprocessor will provide you with the value and benefits you need to stay ahead of the competition. Elevate your projects with the MSP430F67771IPZR and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the internal components of the IC, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and convenient assembly onto circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options, accommodating a wider range of applications.

Package Shape: SQUARE

Square package shape provides efficient use of space on circuit boards, optimizing PCB layout and design.

Bit Size: 16

16-bit architecture offers improved processing capabilities and performance compared to lower bit sizes, making it suitable for more complex tasks.

Power Supplies (V): 2/3.3

Support for dual power supply voltages enables compatibility with a variety of power sources, enhancing the versatility of the IC.

No. of Terminals: 100

Having a higher number of terminals allows for more connections and functionality, increasing the potential applications for the IC.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and easier integration into compact electronic devices.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage helps in reducing power consumption and extends battery life in portable electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance under various environmental conditions, making it suitable for industrial use.

CPU Family: MSP430

Belonging to the MSP430 CPU family signifies efficiency, low power consumption, and robust performance, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function reliably in extreme cold environments, enhancing its versatility in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal position enables easy and stable installation on the PCB, reducing the risk of connection failures and improving overall performance.

ROM Words: 262144

Large ROM capacity of 262144 words allows for storing complex programs and data, enabling the IC to perform a wide range of functions.

Maximum Seated Height: 1.6 mm

Low seated height ensures compatibility with slim device designs and facilitates efficient heat dissipation and component placement.

Width: 14 mm

Compact width dimension helps in space-constrained applications and allows for easy integration into various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 30 seconds provides optimal solder joint formation during manufacturing, ensuring reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder melting and bonding, contributing to robust PCB assembly.

Length: 14 mm

Short length dimension facilitates space-efficient design and allows for flexibility in PCB layout and component placement.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating signifies the IC's reliability, durability, and performance in harsh operating conditions, suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit type enables the IC to handle various peripheral functions and interfaces, enhancing its versatility and usability.

RAM Bytes: 32768

Sizeable RAM capacity of 32768 bytes allows for efficient data storage and processing, supporting multitasking and complex operations.

Technology: CMOS

CMOS technology offers low power consumption, high-speed operation, and reliability, making the IC ideal for battery-powered and energy-efficient devices.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring secure connections and high-quality performance.

Maximum Supply Current: 11.75 mA

Low maximum supply current consumption of 11.75 mA helps in reducing power usage and heat generation, enhancing the energy efficiency of the IC.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent performance and compatibility with standard power sources, simplifying system design.

ROM Programmability: FLASH

ROM programmability via flash technology allows for easy firmware updates and customization, enabling flexible application development.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5 mm enables high-density mounting on the PCB, saving space and improving signal integrity in electronic systems.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the IC's resistance to moisture sensitivity during storage and assembly processes, ensuring reliability in humid environments.

Speed: 25 rpm

Speed rating of 25 rpm reflects the IC's processing capability and performance efficiency, enabling quick data processing and response times in applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67771IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67771IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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