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AM1808EZCE4

Texas Instruments

AM1808EZCE4 by Texas Instruments

AM1808EZCE4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 30 MHz, suitable for low power applications in industrial automation and embedded systems. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.65 mm.

Median Price

$14.890

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44 parts In-Stock

1+ parts

$10.780

100+ parts

$10.560

1k+ parts

$10.350

10k+ parts

-

44

$10.780

$10.560

$10.350

-

Arrow

USA . 498 parts In-Stock

1+ parts

$14.890

100+ parts

-

1k+ parts

$13.990

10k+ parts

-

498

$14.890

-

$13.990

-

Verical

USA . 498 parts In-Stock

1+ parts

$14.890

100+ parts

-

1k+ parts

-

10k+ parts

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498

$14.890

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-

-

Texas Instruments

USA . 14,804 parts In-Stock

1+ parts

$16.799

100+ parts

$14.674

1k+ parts

$10.120

10k+ parts

-

14,804

$16.799

$14.674

$10.120

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Chip1Stop

Japan . 548 parts In-Stock

1+ parts

$17.200

100+ parts

-

1k+ parts

$14.750

10k+ parts

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548

$17.200

-

$14.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,380 parts In-Stock

1+ parts

$13.994

100+ parts

-

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-

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3,380

$13.994

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-

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Vyrian

USA . 4,233 parts In-Stock

1+ parts

-

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4,233

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-

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Goldney Electronics S.L.

Spain . 9 parts In-Stock

1+ parts

-

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-

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9

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Elcom Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,222 parts In-Stock

1+ parts

$13.257

100+ parts

-

1k+ parts

-

10k+ parts

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2,222

$13.257

-

-

-

Parana Technologies

USA . 1,828 parts In-Stock

1+ parts

$14.511

100+ parts

-

1k+ parts

$14.951

10k+ parts

-

1,828

$14.511

-

$14.951

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DigiPath Technology Company

USA . 1,063 parts In-Stock

1+ parts

$15.979

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

$15.979

-

-

-

ChromeModa Solutions

Germany . 3,303 parts In-Stock

1+ parts

$16.305

100+ parts

$13.370

1k+ parts

-

10k+ parts

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3,303

$16.305

$13.370

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IDEA Electronic Components Group

UK . 642 parts In-Stock

1+ parts

$16.305

100+ parts

$15.490

1k+ parts

$14.674

10k+ parts

-

642

$16.305

$15.490

$14.674

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AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$21.820

100+ parts

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-

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358

$21.820

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-

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Microchip USA

USA . 962 parts In-Stock

1+ parts

$42.000

100+ parts

$41.400

1k+ parts

$41.100

10k+ parts

$40.800

962

$42.000

$41.400

$41.100

$40.800

QUARKTWIN TECHNOLOGY LTD

USA . 24,724 parts In-Stock

1+ parts

-

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24,724

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-

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Northwest PG Solutions

USA . 1,842 parts In-Stock

1+ parts

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1,842

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-

-

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Authorized Procurement Solutions

USA . 1,300 parts In-Stock

1+ parts

-

100+ parts

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1,300

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-

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Native Components

USA . 958 parts In-Stock

1+ parts

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958

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Metaverse IC Inc.

Canada . 524 parts In-Stock

1+ parts

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524

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Overview

Experience the cutting-edge technology of the Texas Instruments AM1808EZCE4 microprocessor, designed with precision and quality in mind. With integrated cache and low power mode, this versatile product offers exceptional performance for a wide range of applications. From industrial automation to consumer electronics, this microprocessor is the ideal choice for those seeking reliability, efficiency, and innovation. Trust in Texas Instruments to deliver top-of-the-line solutions that exceed expectations and propel your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and heat resistance, making the microprocessor more reliable in various operating conditions.

Integrated Cache: YES

Having integrated cache improves the processing speed and overall performance of the microprocessor.

Maximum Supply Voltage: 1.35 V

Higher maximum supply voltage allows for better performance and flexibility in power management.

Address Bus Width: 23

A wider address bus width allows the processor to access a larger range of memory addresses, enabling faster data retrieval and processing.

Bit Size: 32

A 32-bit architecture offers efficient processing capabilities for a wide range of applications while maintaining compatibility with existing software.

No. of Terminals: 361

More terminals provide greater connectivity options and enable the microprocessor to interface with various components for enhanced functionality.

Maximum Operating Temperature: 90 °C

High maximum operating temperature ensures stable performance even in demanding thermal conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

A microprocessor with RISC architecture offers high performance and efficiency for processing complex instructions quickly.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation, making the microprocessor energy-efficient and reliable.

Speed: 456 rpm

The high speed of 456 rpm allows for fast data processing and efficient multitasking capabilities.

Technical Specifications

Microprocessors AM1808EZCE4 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

23

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.3 mm

Speed:

456 rpm

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1808EZCE4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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