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STGD10NC60HDT4

STMicroelectronics

STGD10NC60HDT4 by STMicroelectronics

STGD10NC60HDT4 by STMicroelectronics is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 20A max collector current, and 62W max power dissipation. Ideal for power control applications, it features a built-in diode, 247ns turn-off time, and operates up to 150°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,529 parts In-Stock

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3,529

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Anansix

USA . 2,652 parts In-Stock

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Digiode

USA . 1,809 parts In-Stock

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1,809

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Nova Conductors

Japan . 450 parts In-Stock

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450

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IDEA Electronic Components Group

UK . 1,278 parts In-Stock

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$1.656

100+ parts

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$1.490

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$1.656

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$1.490

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MKK Technologies

India . 279 parts In-Stock

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$3.114

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279

$3.114

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DigiPath Technology Company

USA . 279 parts In-Stock

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$3.114

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279

$3.114

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AZTECH Wire

Italy . 698 parts In-Stock

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$7.727

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698

$7.727

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Ampacity Inc.

Singapore . 482 parts In-Stock

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$53.050

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Lixinc

USA . 12,814 parts In-Stock

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Corphita

USA . 3,225 parts In-Stock

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Parana Technologies

USA . 1,084 parts In-Stock

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$1.980

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$1.980

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Perfect Parts

USA . 803 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Unlock the power of efficient power control with the STGD10NC60HDT4 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Insulated Gate Bipolar Transistors (IGBT) that are perfect for a wide range of applications. With a single configuration and built-in diode, this N-channel transistor ensures reliable performance and maximum power dissipation of 62W. Whether you're looking to enhance your power control system or improve overall efficiency, the STGD10NC60HDT4 offers unmatched value and benefits for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components, making it suitable for high power control applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency, making them a better choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves the switching performance and efficiency of the IGBT, making it a convenient choice for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in controlling high power loads.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation, making it suitable for automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space and easy integration into circuit layouts.

Nominal Turn Off Time (toff): 247 ns

The fast turn-off time ensures quick switching capabilities, enhancing efficiency and reducing power losses in power control applications.

No. of Terminals: 2

Having only 2 terminals simplifies the design and connection process, making it easier to integrate into circuits.

Maximum Power Dissipation (Abs): 62 W

With a high power dissipation rating, this IGBT can handle high power loads without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for dense packing in compact electronic devices.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this IGBT can withstand extended use in harsh environments without sacrificing performance.

Maximum Collector-Emitter Voltage: 600 V

The high collector-emitter voltage rating allows for the control of high voltage circuits, expanding the range of applications for this IGBT.

Transistor Element Material: SILICON

The silicon material used in the transistor element provides high reliability and efficiency, making it a durable choice for power control applications.

Maximum Gate-Emitter Voltage: 20 V

With a high gate-emitter voltage rating, this IGBT can handle higher gate drive voltages, ensuring precise control over switching operations.

Maximum Collector Current (IC): 20 A

The high collector current rating allows this IGBT to handle high current loads, making it suitable for power control applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

The low gate-emitter threshold voltage ensures easy and efficient gate control, improving the overall performance of the IGBT.

Terminal Finish: MATTE TIN

The matte tin finish provides a reliable and durable contact surface for secure connections in power control applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and improves reliability by reducing the number of connection points.

Case Connection: COLLECTOR

The collector case connection simplifies the circuit design and improves heat dissipation, enhancing the overall performance of the IGBT.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and assembly processes, guaranteeing the reliability of the IGBT.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature rating, this IGBT can withstand high-temperature soldering processes without damage, ensuring secure connections.

Nominal Turn On Time (ton): 19 ns

The fast turn-on time ensures quick response and precise control over switching operations, making it suitable for high-speed power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGD10NC60HDT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

247 ns

Nominal Turn On Time (ton):

19 ns

Trade Compliance

STGD10NC60HDT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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