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STGD25N36LZAG

STMicroelectronics

STGD25N36LZAG by STMicroelectronics

STGD25N36LZAG from STMicroelectronics is an N-channel IGBT designed for automotive ignition applications. It features a max VCEsat of 1.25V, power dissipation of 150W, and operates b/w -55 °C to 175 °C. Its built-in TVS diode enhances reliability in demanding environments.

Median Price

$0.631

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,485 parts In-Stock

1+ parts

$2.010

100+ parts

$0.888

1k+ parts

$0.629

10k+ parts

$0.598

2,485

$2.010

$0.888

$0.629

$0.598

Arrow

USA . 650,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.631

650,000

-

-

-

$0.631

Verical

USA . 380,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.550

380,000

-

-

-

$0.550

Distributors (In-Stock)

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Digiode

USA . 2,748 parts In-Stock

1+ parts

-

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2,748

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Vyrian

USA . 2,470 parts In-Stock

1+ parts

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2,470

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Anansix

USA . 1,007 parts In-Stock

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1,007

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,176 parts In-Stock

1+ parts

$0.978

100+ parts

-

1k+ parts

$0.880

10k+ parts

-

1,176

$0.978

-

$0.880

-

MKK Technologies

India . 1,628 parts In-Stock

1+ parts

$1.839

100+ parts

-

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10k+ parts

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1,628

$1.839

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DigiPath Technology Company

USA . 1,628 parts In-Stock

1+ parts

$1.839

100+ parts

-

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-

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1,628

$1.839

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Microchip USA

USA . 5,598 parts In-Stock

1+ parts

$5.309

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5,598

$5.309

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AZTECH Wire

Italy . 879 parts In-Stock

1+ parts

$12.360

100+ parts

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879

$12.360

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Glotronic Ltd.

UK . 153,279 parts In-Stock

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153,279

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 4,516 parts In-Stock

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4,516

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Parana Technologies

USA . 1,261 parts In-Stock

1+ parts

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$1.169

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1,261

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$1.169

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Overview

Elevate your automotive ignition solutions with the STGD25N36LZAG from STMicroelectronics, a trusted name in innovative electronics. This N-channel IGBT combines robust performance with built-in protection, ensuring reliability under extreme conditions. Designed for efficiency and longevity, it seamlessly handles high power needs while enhancing system safety. Experience unparalleled quality and support—opt for STMicroelectronics to drive your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and thermal performance, making this IGBT suitable for harsh automotive environments.

Polarity or Channel Type: N-CHANNEL

N-channel devices generally exhibit better efficiency and higher speed, making this IGBT ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN TVS DIODE AND RESISTOR

The built-in TVS diode provides protection against voltage spikes, which increases reliability in automotive ignition applications.

Transistor Application: AUTOMOTIVE IGNITION

Designed specifically for automotive ignition, this IGBT ensures reliable performance in vehicle ignition systems.

Surface Mount: YES

Surface mount technology allows for compact designs and simplifies automatic assembly processes, optimizing production efficiency.

Maximum VCEsat: 1.25 V

A low VCEsat minimizes power loss during operation, enhancing overall system efficiency for automotive applications.

Package Shape: RECTANGULAR

The rectangular package design offers efficient use of space, allowing for better thermal management and easier integration.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, improving the board-level assembly process.

Nominal Turn Off Time (toff): 14500 ns

This relatively short turn-off time allows for higher frequency operation, beneficial in dynamic automotive applications.

No. of Terminals: 2

Having only two terminals simplifies connections and reduces the complexity of the circuit design.

Maximum Power Dissipation (Abs): 150 W

A high maximum power dissipation rating makes this IGBT capable of handling demanding applications without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package occupies less board space, which is advantageous for compact automotive electronics.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature ensures that the IGBT can function reliably under extreme conditions found in automotive environments.

Maximum Collector-Emitter Voltage: 385 V

The capability to handle high voltages enables this IGBT to perform effectively in a range of high-voltage automotive applications.

Transistor Element Material: SILICON

Silicon material offers excellent electrical characteristics, ensuring high performance and reliability in transistor applications.

Maximum Gate-Emitter Voltage: 16 V

A high gate-emitter voltage rating allows for greater flexibility in circuit design and improved control of the IGBT.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable performance in cold environments typical in automotive applications.

Maximum Collector Current (IC): 25 A

The ability to handle high collector current makes this IGBT suitable for demanding automotive tasks that require substantial current handling.

Maximum Gate-Emitter Threshold Voltage: 2.1 V

A low threshold voltage provides ease of drive and helps to minimize power consumption, enhancing the overall efficiency of the device.

Terminal Position: SINGLE

The single terminal position allows for straightforward configuration, simplifying the integration into various applications.

Case Connection: COLLECTOR

The collector connection style optimizes the flow of current, enhancing the efficiency and performance of the IGBT.

Nominal Turn On Time (ton): 4560 ns

A fast turn-on time enables higher switching frequencies, making this IGBT suitable for modern automotive systems requiring rapid response.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standards ensures that this IGBT meets stringent automotive reliability and performance requirements.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGD25N36LZAG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

385 V

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

16 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

14500 ns

Nominal Turn On Time (ton):

4560 ns

Maximum VCEsat:

1.25 V

Trade Compliance

STGD25N36LZAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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