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STGD10NC60SDT4

STMicroelectronics

STGD10NC60SDT4 by STMicroelectronics

STGD10NC60SDT4 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, 18 A collector current, and a fast turn-off time of 560 ns. Ideal for surface mount designs, it operates up to 150 °C.

Median Price

$3.290

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,934 parts In-Stock

1+ parts

$3.290

100+ parts

$1.487

1k+ parts

$1.118

10k+ parts

-

1,934

$3.290

$1.487

$1.118

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,198 parts In-Stock

1+ parts

$2.346

100+ parts

-

1k+ parts

-

10k+ parts

-

1,198

$2.346

-

-

-

Vyrian

USA . 2,990 parts In-Stock

1+ parts

$2.470

100+ parts

-

1k+ parts

-

10k+ parts

-

2,990

$2.470

-

-

-

Anansix

USA . 943 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

943

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$1.438

100+ parts

-

1k+ parts

$1.294

10k+ parts

-

379

$1.438

-

$1.294

-

Corphita

USA . 686 parts In-Stock

1+ parts

$2.223

100+ parts

-

1k+ parts

-

10k+ parts

-

686

$2.223

-

-

-

MKK Technologies

India . 331 parts In-Stock

1+ parts

$2.704

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$2.704

-

-

-

DigiPath Technology Company

USA . 331 parts In-Stock

1+ parts

$2.704

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$2.704

-

-

-

Perfect Parts

USA . 2,475 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,475

-

-

-

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

-

100+ parts

$1.719

1k+ parts

-

10k+ parts

-

1,380

-

$1.719

-

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Overview

Elevate your power control projects with the STGD10NC60SDT4 IGBT from STMicroelectronics. Renowned for its exceptional quality and reliability, this N-channel transistor delivers outstanding performance in demanding applications. With built-in diode functionality and optimized for efficiency, it seamlessly integrates into various systems, ensuring robust operation even under high temperatures. Trust STMicroelectronics for cutting-edge solutions that drive your innovations forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers excellent thermal and electrical insulation, making this IGBT reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs provide high efficiency and better performance in power applications, making them a preferred choice for power control.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a single configuration with a built-in diode simplifies circuit design and improves performance in power applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for applications like inverters, converters, and motor drives.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient PCB layout and maximizes space utilization in design.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and make handling easier during assembly, improving manufacturing efficiency.

Nominal Turn Off Time (toff): 560 ns

The relatively short turn-off time enhances switching performance and reduces losses, ideal for high-frequency applications.

No. of Terminals: 2

Having only two terminals simplifies integration into circuits and reduces potential points of failure.

Maximum Power Dissipation (Abs): 60 W

With a maximum power dissipation of 60 W, this IGBT can handle substantial workloads while maintaining performance stability.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables higher density designs, optimizing space on printed circuit boards.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures reliability and performance in high-temperature environments as needed for power applications.

Maximum Collector-Emitter Voltage: 600 V

Capable of handling high voltages up to 600 V, this IGBT is suitable for a wide range of industrial applications.

Transistor Element Material: SILICON

Silicon as the element material provides a good balance of performance and cost, making this IGBT a practical choice for many applications.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for optimal control and reduces the risk of gate damage during operation.

Maximum Collector Current (IC): 18 A

With a maximum rated collector current of 18 A, this device can comfortably handle significant load requirements in power applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

The threshold voltage provides a favorable balance between turn-on speed and control, enhancing operational efficiency.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and reduces the likelihood of whiskering in applications, enhancing reliability.

Terminal Position: SINGLE

Single terminal position simplifies PCB design and provides straightforward integration into circuits.

Case Connection: COLLECTOR

Collector case connection design optimizes thermal management and supports more effective power distribution in the circuit.

Maximum Time At Peak Reflow Temperature: 30 s

Allowing a maximum exposure of 30 seconds at peak reflow temperature facilitates easier handling and assembly processes.

Peak Reflow Temperature: 260 °C

A peak reflow temperature of 260 °C ensures compatibility with modern soldering processes, enhancing manufacturing efficiency.

Nominal Turn On Time (ton): 22.5 ns

Fast turn-on time of 22.5 ns supports high-speed applications, making this IGBT suitable for demanding power control systems.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGD10NC60SDT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

ULTRA FAST

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

560 ns

Nominal Turn On Time (ton):

22.5 ns

Trade Compliance

STGD10NC60SDT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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