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STGD14NC60KT4

STMicroelectronics

STGD14NC60KT4 by STMicroelectronics

STGD14NC60KT4 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, 25 A collector current, and operates at up to 150 °C. Its compact surface mount design ensures versatility in various electronic systems.

Median Price

$2.500

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,250 parts In-Stock

1+ parts

$2.500

100+ parts

$1.100

1k+ parts

$0.812

10k+ parts

$0.713

1,250

$2.500

$1.100

$0.812

$0.713

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,914 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

-

10k+ parts

-

3,914

$2.375

-

-

-

Vyrian

USA . 3,605 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

3,605

$2.500

-

-

-

Bristol Electronics

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,500

-

-

-

-

Anansix

USA . 2,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,864

-

-

-

-

ComSIT Distribution GmbH

Germany . 595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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595

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 31 parts In-Stock

1+ parts

$1.163

100+ parts

-

1k+ parts

$1.047

10k+ parts

-

31

$1.163

-

$1.047

-

Ampacity Inc.

Singapore . 896 parts In-Stock

1+ parts

$2.130

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$2.130

-

-

-

MKK Technologies

India . 473 parts In-Stock

1+ parts

$2.187

100+ parts

-

1k+ parts

-

10k+ parts

-

473

$2.187

-

-

-

DigiPath Technology Company

USA . 473 parts In-Stock

1+ parts

$2.187

100+ parts

-

1k+ parts

-

10k+ parts

-

473

$2.187

-

-

-

Corphita

USA . 2,932 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

-

2,932

$2.250

-

-

-

Kepictronics

USA . 103,750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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103,750

-

-

-

-

RC Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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12,000

-

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

-

-

-

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,400

-

-

-

-

Parana Technologies

USA . 1,863 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

-

10k+ parts

-

1,863

-

$1.390

-

-

Perfect Parts

USA . 342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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342

-

-

-

-

Overview

Unlock the power of efficiency with the STGD14NC60KT4 from STMicroelectronics, a leader in semiconductor innovation. This high-performance IGBT delivers exceptional power control and reliability for a wide range of applications, from industrial drives to renewable energy systems. With its robust design and superior thermal management, you can trust it to operate smoothly even in demanding environments, maximizing your system's performance while minimizing energy costs. Experience the difference of quality engineering that stands the test of time!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection from environmental factors, ensuring the longevity and reliability of the IGBT.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer better performance characteristics such as lower on-resistance, making them suitable for high-efficiency applications.

Configuration: SINGLE

A single configuration simplifies circuit design, making it easier to integrate into various applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for applications requiring high voltage and current handling capabilities.

Surface Mount: YES

Surface mount capability allows for compact designs and easy automation in manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB while enhancing thermal performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering properties, facilitating reliable connections and ease of installation.

Nominal Turn Off Time (toff): 340 ns

A fast turn-off time ensures efficient switching, reducing energy losses during operation.

No. of Terminals: 2

With 2 terminals, the device maintains a simplified design while effectively handling power control tasks.

Maximum Power Dissipation (Abs): 80 W

An 80 W power dissipation rating indicates the device's robustness in high-power applications, ensuring reliability under heavy loads.

Package Style (Meter): SMALL OUTLINE

Small outline packaging makes it suitable for space-constrained applications and can improve heat dissipation.

Maximum Operating Temperature: 150 °C

This IGBT can operate at elevated temperatures, enhancing its versatility in demanding environments.

Maximum Collector-Emitter Voltage: 600 V

A collector-emitter voltage rating of 600 V makes this IGBT suitable for high-voltage applications, widening its usability.

Transistor Element Material: SILICON

Silicon material ensures good thermal conductivity and reliable performance for power control applications.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows for flexible driving options, enabling compatibility with various controller designs.

Maximum Collector Current (IC): 25 A

With a maximum collector current of 25 A, this IGBT can handle substantial current loads, making it perfect for power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

A threshold voltage of 6.5 V provides effective control over turn-on/off, ensuring the efficient operation of the device.

Terminal Finish: Matte Tin (Sn)

Matte tin finish offers good solderability and improves the reliability of the electrical connections.

Terminal Position: DUAL

Dual-position terminals provide flexible layout options for PCB designers, aiding in optimizing circuit design.

Nominal Turn On Time (ton): 31.5 ns

With a low turn-on time of 31.5 ns, this IGBT allows for rapid switching, which is essential for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGD14NC60KT4 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PDSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

340 ns

Nominal Turn On Time (ton):

31.5 ns

Trade Compliance

STGD14NC60KT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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