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M50FW080N5

STMicroelectronics

M50FW080N5 by STMicroelectronics

M50FW080N5 by STMicroelectronics is a 3.3V NOR Flash Memory with 1MX8 organization, 16 sectors of 64K words each, and operates synchronously at a max temperature of 85 °C. It is ideal for applications requiring fast access times, such as embedded systems and consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 20,100 parts In-Stock

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Vyrian

USA . 3,221 parts In-Stock

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3,221

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Velocity Electronics

USA . 2,079 parts In-Stock

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2,079

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Anansix

USA . 971 parts In-Stock

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971

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ComSIT Distribution GmbH

Germany . 855 parts In-Stock

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855

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Digiode

USA . 807 parts In-Stock

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807

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Inventory MP

USA . 210 parts In-Stock

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210

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Bristol Electronics

USA . 210 parts In-Stock

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210

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Cyclops Electronics Ltd

UK . 116 parts In-Stock

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Semtec, LLC

USA . 85 parts In-Stock

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Prism Electronics

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 1,805 parts In-Stock

1+ parts

$0.960

100+ parts

$0.920

1k+ parts

$0.890

10k+ parts

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1,805

$0.960

$0.920

$0.890

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IDEA Electronic Components Group

UK . 842 parts In-Stock

1+ parts

$4.829

100+ parts

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$4.346

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842

$4.829

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$4.346

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MKK Technologies

India . 65 parts In-Stock

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$9.081

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65

$9.081

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DigiPath Technology Company

USA . 65 parts In-Stock

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$9.081

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$9.081

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AZTECH Wire

Italy . 582 parts In-Stock

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$18.280

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582

$18.280

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Kepictronics

USA . 14,930 parts In-Stock

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Assy Fe

Spain . 6,219 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 3,899 parts In-Stock

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Parana Technologies

USA . 1,944 parts In-Stock

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$5.774

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$5.774

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A-Z Elektronik GmbH

Germany . 1,853 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,235 parts In-Stock

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Microchip USA

USA . 443 parts In-Stock

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Perfect Parts

USA . 234 parts In-Stock

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234

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Overview

Experience high-quality, reliable performance with the M50FW080N5 Flash Memory by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics brings you a versatile product that is ideal for a wide range of applications. This flash memory offers exceptional value and benefits to customers, providing fast access times, low power consumption, and a compact design. Whether you're looking to enhance your device's storage capabilities or improve overall performance, the M50FW080N5 is the perfect solution for your needs. Elevate your technology with this innovative product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the flash memory, ensuring longevity and reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer speeds and more efficient communication between the flash memory and the device it is used in.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is commonly used in electronic devices, providing compatibility and ease of integration with various systems.

Organization: 1MX8

The 1MX8 organization means that the flash memory has a capacity of 1 megabit organized into 8-bit words, offering a balance between storage capacity and data access efficiency.

Technology: CMOS

CMOS technology is known for its low power consumption and high reliability, making this flash memory energy-efficient and long-lasting.

Memory IC Type: FLASH

Flash memory is widely used for its non-volatile nature, allowing data to be stored even when the power is turned off, making it ideal for storing important information.

Maximum Access Time: 11 ns

The fast access time of 11 nanoseconds ensures quick retrieval of data, reducing latency and improving overall performance of the flash memory.

Technical Specifications

Flash Memory M50FW080N5 attributes and parameters. Explore more Flash Memory devices from STMicroelectronics

Specs

Maximum Access Time:

11 ns

Command User Interface:

YES

Data Polling:

NO

JESD-30 Code:

R-PDSO-G40

JESD-609 Code:

e0

Length:

18.4 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Sectors/Size:

16

No. of Terminals:

40

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP40,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Power Supplies (V):

3.3

Programming Voltage (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sector Size (Words):

64K

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Toggle Bit:

NO

Type:

NOR TYPE

Width:

10 mm

Trade Compliance

M50FW080N5 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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