Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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M36W216B100ZA6T from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal voltage. It features 1M x 16 organization and operates in temperatures ranging from -40 °C to 85 °C. Ideal for industrial applications, it offers high-density storage in a compact package.
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$4.860
The plastic/epoxy material offers excellent durability and cost-effectiveness, making it a reliable choice for various applications.
Surface mount technology allows for easier assembly and a more compact design, which is essential for modern electronics.
The rectangular package shape optimizes space and layout efficiency on printed circuit boards.
Asynchronous operation allows for faster data access with minimal latency, making it suitable for high-performance applications.
A nominal supply voltage of 3V balances power consumption and performance, making it ideal for battery-operated devices.
With 66 terminals, this IC provides sufficient connections for extensive functionality and integration into complex systems.
The low-profile, fine pitch grid array allows for high-density mounting on PCBs, essential in compact design applications.
With a maximum operating temperature of 85 °C, this memory IC is suitable for industrial environments and applications requiring thermal resilience.
This organization provides a balanced structure for data storage, optimizing performance in data-intensive applications.
A minimum operating temperature of -40 °C ensures reliable performance in extreme conditions, making it suitable for industrial and automotive applications.
Bottom terminal positioning allows for effective heat dissipation and is beneficial for surface mount assembly processes.
A maximum seated height of 1.4 mm contributes to a low profile design, which is advantageous for space-constrained applications.
An 8 mm width allows for compact layout and is easy to accommodate in a variety of electronic devices.
A minimum supply voltage of 2.7V increases versatility in power supply options and extends battery life in portable applications.
With a length of 12 mm, the IC is optimized for compact designs while maintaining robust performance.
Designed for industrial temperature ranges, this IC is reliable in challenging conditions, enhancing its application scope in tough environments.
CMOS technology is known for low power consumption and high speed, making this IC efficient for a wide range of applications.
Ball terminal form provides superior soldering quality and reliability, enhancing overall performance and durability of the IC.
With 1,048,576 words, this IC provides substantial data storage capacity, suitable for applications requiring significant memory resources.
A memory width of 16 enhances data throughput, allowing for faster processing in applications that demand high-speed operations.
A terminal pitch of 0.8 mm allows for higher density designs without compromising signal integrity, which is crucial for modern electronics.
With a word code of 1M, this IC is well-suited for applications that require substantial data handling capabilities.
A maximum supply voltage of 3.3V covers a wide range of applications, ensuring compatibility with various system designs.
A memory density of 16,777,216 bits provides ample storage, making this IC a great choice for data-heavy applications.
As a dedicated memory circuit, this IC is optimized for data storage, ensuring reliable performance in memory-critical applications.
Other Function Memory ICs M36W216B100ZA6T attributes and parameters. Explore more Other Function Memory ICs devices from STMicroelectronics
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M36W216B100ZA6T Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
NE555D
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
MBRS360T3G
Onsemi
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Panjit International
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
SMBJ18CA
Zowie Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Electronic Transistors
C1702A
Advanced Micro Devices
Other Memory ICs; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;
M36W108T120ZN1T
STMicroelectronics M36W108T120ZN1T is a 1MX8 memory IC with 8388608 bit memory density. It operates in asynchronous mode, with CMOS technology and 2.7-3.6V supply voltage range. Suitable for commercial applications, it features a grid array package style and very thin profile for compact designs.
M36W216T100ZA1
M36W216T100ZA1 from STMicroelectronics is a low-profile, asynchronous memory IC with a 3V nominal supply and operates b/w 2.7V to 3.3V. It features a density of 16Mbit, organized as 1Mx16, and supports commercial temp ranges up to 70 °C. Ideal for compact applications requiring efficient data storage in embedded systems.
M36W108B120ZM6T
STMicroelectronics M36W108B120ZM6T is a 1MX8 memory IC with 8388608 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and supports asynchronous mode. With low profile grid array package, it's ideal for applications requiring high-speed data storage and retrieval.
M36W108T120ZN1
M36W108T120ZN1 from STMicroelectronics is a versatile memory IC featuring 1M x 8 organization, operating at 3/3.3V with a max access time of 120 ns. Its thin profile and asynchronous mode make it ideal for compact applications. This CMOS device supports both FLASH and SRAM technologies.
47L16T-I/SN
47L16T-I/SN by Microchip Technology is a small outline memory IC with 2Kx8 organization, EEPROM+SRAM mixed memory type, and synchronous operating mode. It is used in industrial applications for storing 2048 words of data with a memory density of 16384 bits and max access time of 400 ns.
MR2A16ACYS35
Freescale Semiconductor
MR2A16ACYS35 by Freescale Semiconductor is a 256Kx16 memory IC with 3.3V supply, operating in industrial temperature range of -40 to 85°C. It features asynchronous mode, 35ns access time, and GULL WING terminals. Ideal for applications requiring high-speed memory operations in compact electronic devices.
TMS4C2973-26DT
TMS4C2973-26DT by Texas Instruments is a 36-terminal memory IC with 3.3V supply, operating b/w 0-70°C. It features a max access time of 21ns and standby current of 0.01A, suitable for commercial applications requiring fast data retrieval in small outline packages.
DS1207-G04
Analog Devices
DS1207-G04 by Analog Devices is a CMOS MEMORY CIRCUIT with 5 terminals. It operates SYNCHRONOUSLY at temperatures from 0 °C to 70°C. This RECTANGULAR IC is ideal for commercial applications requiring SPECIAL SHAPE packages.
ATSHA204A-STUCZ-T
Atmel
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2 V;
TMS2564JDL
TMS2564JDL by Texas Instruments is an 8KX8 memory IC with 65536-bit density and 450ns access time. Featuring a MOS technology, it has a temperature range of 0-70°C. Commonly used in applications requiring fast data retrieval such as embedded systems and industrial automation.
SNJ54HC670FK
SNJ54HC670FK by Texas Instruments is a CMOS memory IC with 20 terminals in a chip carrier package. Operating temperature ranges from -55 to 125°C, suitable for military-grade applications. It has power supplies of 2-6V and is surface mountable, making it ideal for various electronic devices.
M36W108T100ZM6T
STMicroelectronics M36W108T100ZM6T is a 1MX8 memory IC with 8388608 bit memory density. It operates in industrial temperature range (-40 to 85 °C) and supports asynchronous mode. With a package style of grid array, low profile, it is suitable for various applications requiring high-density memory solutions.
TMX27PC128N30
Other Memory ICs;
TACT2153-28FN
TACT2153-28FN by Texas Instruments is a 1KX11 memory circuit IC with 11264-bit memory density. It features a max access time of 25ns, operates b/w 0°C to 70°C, and has a terminal pitch of 1.27mm. This chip carrier package is ideal for applications requiring fast data retrieval in commercial-grade temperature environments.
DS1652B
Analog Devices' DS1652B is a CMOS Memory Circuit IC with 8 terminals, operating at 0-70 °C. It has a supply voltage of 5V and comes in an IN-LINE package style. Ideal for commercial applications requiring reliable memory functions.
DS2411R+T&R
DS2411R+T&R by Analog Devices is a 64-bit MEMORY CIRCUIT with 64x1 organization. Operating at -40 to 85°C, it has a supply voltage range of 1.5-5.25V and consumes 0.1mA max current in standby mode. This PLASTIC/EPOXY IC in SMALL OUTLINE package is ideal for industrial applications requiring asynchronous operation and compact design.
TMS2400JC
TMS2400JC by Texas Instruments is a MOS technology memory IC with 28 terminals in an IN-LINE package. It operates b/w -25°C to 85°C, making it suitable for various applications requiring reliable memory storage in harsh environments. The CERAMIC package ensures durability and stability, ideal for industrial and automotive electronics.
DS1993L-F5+
Maxim Integrated
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 2; Package Shape: ROUND; Terminal Position: END; Operating Mode: ASYNCHRONOUS;
DS1961S-F5
Dallas Semiconductor
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
M36W0R5020B0ZAQT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
M36W0R5020T0ZAQ
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
M36W0R6030B0ZAQT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
M36W0R5020T0ZAQT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 2MX16;
M36W0R5020T0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 33554432 bit;
M36W0R6030T0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
M36W0R6030B0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16;
M36W0R6040B0ZAQE
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+PSRAM;
M36W0R5020B0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Power Supplies (V): 1.8;
M36W0R6030B0ZAQ
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 67108864 bit;
M36W0R6030T0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+SRAM;
M36W0R5020B0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 70 ns;
M36W0R6030T0ZAQT
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
M36W0R6030T0ZAQ
M36W0R6040B0ZAQ
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
M36W0R6040B0ZAQT
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -30 Cel;
M36W0R6040B0ZAQF
MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS;
M36W0R6030B0ZAQE
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
M36W0R5020B0ZAQ
M36W0R5020T0ZAQF
MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 88; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 10 mm;
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