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NGTB75N65FL2WAG

Onsemi

NGTB75N65FL2WAG by Onsemi

NGTB75N65FL2WAG by Onsemi is an N-CHANNEL IGBT with 650V VCEsat and 200A IC, ideal for POWER CONTROL applications. Featuring a 78ns turn on time and 262ns turn off time, this transistor has a max power dissipation of 536W. Its package style is FLANGE MOUNT with PLASTIC/EPOXY body material.

Median Price

$4.915

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$5.570

100+ parts

$4.420

1k+ parts

$3.360

10k+ parts

$2.600

5

$5.570

$4.420

$3.360

$2.600

Rochester

USA . 38 parts In-Stock

1+ parts

-

100+ parts

$4.260

1k+ parts

$3.810

10k+ parts

$3.580

38

-

$4.260

$3.810

$3.580

Flip Electronics (Authorized)

USA . 30 parts In-Stock

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30

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Digiode

USA . 1,057 parts In-Stock

1+ parts

$4.503

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1,057

$4.503

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Vyrian

USA . 5,365 parts In-Stock

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Flip Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Corphita

USA . 1,794 parts In-Stock

1+ parts

$4.266

100+ parts

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1,794

$4.266

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Corohmni

South Africa . 227 parts In-Stock

1+ parts

$4.740

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227

$4.740

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SupplyDigital Components

Austria . 5,131 parts In-Stock

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Kulean Microsystems

USA . 2,734 parts In-Stock

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Problanco Electronics

Mexico . 2,464 parts In-Stock

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Perfect Parts

USA . 2,296 parts In-Stock

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TANS Electronics

Latvia . 1,891 parts In-Stock

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1,891

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UHIMA Technologies

Türkiye . 432 parts In-Stock

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Overview

Experience superior power control with the NGTB75N65FL2WAG by Onsemi. This insulated gate bipolar transistor offers top-notch quality and reliability, thanks to its manufacturer's reputation for excellence. Ideal for a wide range of applications, this N-channel transistor provides customers with unrivaled value and benefits. Whether you're looking to enhance your power control capabilities or increase efficiency, the NGTB75N65FL2WAG is the perfect choice for your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection to the internal components of the IGBT, making it more durable and reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower ON-state resistance and higher switching speeds, making them suitable for applications requiring high efficiency and fast switching.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse voltage spikes, improving overall system reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring efficient and accurate control over the flow of electrical power within the circuit.

Maximum VCEsat: 2 V

Low saturation voltage helps reduce power losses and improves overall efficiency of the IGBT in power control applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into different electronic systems or circuit boards.

Nominal Turn Off Time (toff): 262 ns

Fast turn-off time enhances the efficiency and performance of the IGBT in power control applications by reducing switching losses.

Maximum Power Dissipation (Abs): 536 W

High power dissipation capability allows the IGBT to handle high power loads without overheating, ensuring long-term reliability.

Maximum Collector-Emitter Voltage: 650 V

High breakdown voltage rating enables the IGBT to withstand high voltage levels in power control applications without breakdown.

Maximum Gate-Emitter Voltage: 20 V

Suitable gate-emitter voltage rating ensures proper switching operation and protection of the IGBT during high voltage applications.

Minimum Operating Temperature: -55 °C

Wide temperature range allows the IGBT to operate reliably in both low and high-temperature environments, making it versatile for various applications.

Maximum Collector Current (IC): 200 A

High collector current rating enables the IGBT to handle large current loads in power control applications, improving overall system performance.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Optimal gate-emitter threshold voltage ensures proper turn-on and turn-off characteristics of the IGBT, enhancing its performance in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB75N65FL2WAG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

262 ns

Nominal Turn On Time (ton):

78 ns

Maximum VCEsat:

2 V

Trade Compliance

NGTB75N65FL2WAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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