Loading...

NGTB50N60S1WG

Onsemi

NGTB50N60S1WG by Onsemi

NGTB50N60S1WG by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2V and a max IC of 100A. It is used for power control applications, featuring a built-in diode and operating temperature range from -55 to 175 °C.

Median Price

$2.958

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,080 parts In-Stock

1+ parts

-

100+ parts

$2.790

1k+ parts

$2.500

10k+ parts

$2.350

1,080

-

$2.790

$2.500

$2.350

Verical

USA . 570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.125

10k+ parts

$2.938

570

-

-

$3.125

$2.938

Flip Electronics (Authorized)

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Avnet

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 754 parts In-Stock

1+ parts

$2.954

100+ parts

-

1k+ parts

-

10k+ parts

-

754

$2.954

-

-

-

Vyrian

USA . 8,233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,233

-

-

-

-

Flip Electronics

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

R&J Components

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 448 parts In-Stock

1+ parts

$2.799

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$2.799

-

-

-

Corohmni

South Africa . 429 parts In-Stock

1+ parts

$3.110

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$3.110

-

-

-

AZTECH Wire

Italy . 194 parts In-Stock

1+ parts

$17.540

100+ parts

-

1k+ parts

-

10k+ parts

-

194

$17.540

-

-

-

Microchip USA

USA . 267 parts In-Stock

1+ parts

$19.370

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$19.370

-

-

-

SupplyDigital Components

Austria . 7,522 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,522

-

-

-

-

Problanco Electronics

Mexico . 4,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,104

-

-

-

-

TANS Electronics

Latvia . 4,094 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,094

-

-

-

-

Continental Prestige Electronics

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$3.080

1k+ parts

-

10k+ parts

-

900

-

$3.080

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

UHIMA Technologies

Türkiye . 498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

498

-

-

-

-

Kulean Microsystems

USA . 315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

315

-

-

-

-

Overview

Unleash the power of innovation with the NGTB50N60S1WG by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their Insulated Gate Bipolar Transistors (IGBT) category. Designed for power control applications, this N-CHANNEL transistor offers a single configuration with a built-in diode, ensuring seamless performance. With a maximum collector-emitter voltage of 600V and a nominal turn-off time of 341ns, this transistor provides exceptional efficiency and stability. Trust Onsemi to deliver cutting-edge technology that surpasses expectations and unlocks endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers good insulation properties and mechanical strength, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Provides efficient operation and control in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable performance.

Maximum VCEsat: 2 V

Low saturation voltage minimizes power loss and improves efficiency.

Package Shape: RECTANGULAR

Facilitates easy mounting and installation in various systems.

Terminal Form: THROUGH-HOLE

Easy to solder and integrate into circuit boards.

Nominal Turn Off Time (toff): 341 ns

Fast turn-off time enhances switching speed and efficiency of the transistor.

Maximum Power Dissipation (Abs): 417 W

High power dissipation capability allows for handling heavy loads without overheating.

Package Style (Meter): FLANGE MOUNT

Enables secure mounting and heat dissipation in demanding environments.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures stable performance in various conditions.

Maximum Collector-Emitter Voltage: 600 V

Can handle high voltage requirements in power applications.

Transistor Element Material: SILICON

Provides high reliability and performance over a wide temperature range.

Maximum Gate-Emitter Voltage: 20 V

Protects the gate-emitter junction from damage during operation.

Minimum Operating Temperature: -55 °C

Can operate in low temperature environments without compromising performance.

Maximum Collector Current (IC): 100 A

Capable of handling high current loads for power control applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Provides a suitable threshold for controlling the transistor in power applications.

Terminal Finish: TIN

Ensures good electrical conductivity and corrosion resistance for reliable connections.

Terminal Position: SINGLE

Simplifies installation and connection in circuits.

Nominal Turn On Time (ton): 139 ns

Fast turn-on time enhances switching speed and efficiency of the transistor.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB50N60S1WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

341 ns

Nominal Turn On Time (ton):

139 ns

Maximum VCEsat:

2 V

Trade Compliance

NGTB50N60S1WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20