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NGTB40N120LWG

Onsemi

NGTB40N120LWG by Onsemi

NGTB40N120LWG by Onsemi is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 80A. It is designed for motor control applications, featuring a nominal turn-off time of 565ns and a max power dissipation of 260W. The transistor has a single configuration with built-in diode in a rectangular package style suitable for flange mount installations.

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Advanced Electronics

New Zealand . 600 parts In-Stock

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AZTECH Wire

Italy . 1,008 parts In-Stock

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Problanco Electronics

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TANS Electronics

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UHIMA Technologies

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Kulean Microsystems

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Overview

Enhance your motor control applications with the NGTB40N120LWG from Onsemi. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled quality and reliability, thanks to Onsemi's reputation as a trusted manufacturer in the industry. With a single configuration and built-in diode, this IGBT provides efficient power dissipation and high collector current capacity, making it ideal for various motor control applications. Experience the value and benefits of using this IGBT, maximizing performance while ensuring longevity and stability in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the IGBT.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow and control in motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the IGBT package.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, providing reliable performance and precise control over motor functions.

Package Shape: RECTANGULAR

Easy to mount and integrate into existing circuitry for improved usability.

Terminal Form: THROUGH-HOLE

Allows for easy soldering and secure connections in circuit boards.

Nominal Turn Off Time (toff): 565 ns

Fast turn off time ensures efficient switching and minimizes power loss in the circuit.

Maximum Power Dissipation (Abs): 260 W

Capable of handling high power applications, making it suitable for demanding motor control tasks.

Maximum Operating Temperature: 150 °C

Can operate efficiently in high temperature environments, enhancing overall performance and reliability.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating allows for use in a wide range of applications, including those requiring high voltage operation.

Maximum Gate-Emitter Voltage: 20 V

Ensures safe and reliable gate control, preventing damage to the IGBT during operation.

Maximum Collector Current (IC): 80 A

Capable of handling high current loads, making it suitable for motor control applications that require high current output.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Ensures precise control over the gate signal, resulting in accurate switching and improved performance.

Terminal Finish: TIN

Provides a reliable and corrosion-resistant terminal finish for long-term performance and durability.

Terminal Position: SINGLE

Simplifies installation and connection of the IGBT in the circuit.

Case Connection: COLLECTOR

Provides a direct connection to the collector for efficient current flow and performance.

Nominal Turn On Time (ton): 178 ns

Fast turn on time ensures quick and responsive switching, improving the overall efficiency of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB40N120LWG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

565 ns

Nominal Turn On Time (ton):

178 ns

Trade Compliance

NGTB40N120LWG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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