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NGTB40N120FL2WAG

Onsemi

NGTB40N120FL2WAG by Onsemi

NGTB40N120FL2WAG by Onsemi is an N-CHANNEL IGBT with 1200V VCE, 160A IC, and 536W power dissipation. Ideal for power control applications, it features a built-in diode, 360ns turn-off time, and -55 to 175 °C operating temperature range.

Median Price

$1.902

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 1 parts In-Stock

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$0.485

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Chip1Stop

Japan . 1 parts In-Stock

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$3.320

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Digiode

USA . 734 parts In-Stock

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$0.461

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Vyrian

USA . 2,845 parts In-Stock

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Corphita

USA . 469 parts In-Stock

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$0.436

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Corohmni

South Africa . 135 parts In-Stock

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AZTECH Wire

Italy . 1,186 parts In-Stock

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$12.300

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Kulean Microsystems

USA . 7,050 parts In-Stock

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SupplyDigital Components

Austria . 5,977 parts In-Stock

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TANS Electronics

Latvia . 5,700 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,617 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 428 parts In-Stock

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Kepictronics

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Overview

Enhance your power control applications with the NGTB40N120FL2WAG by Onsemi, a high-quality insulated gate bipolar transistor that delivers superior performance and reliability. Featuring a single configuration with a built-in diode, this N-channel transistor offers a maximum VCEsat of 2.4V and a maximum collector-emitter voltage of 1200V, making it ideal for a wide range of power control tasks. With a maximum power dissipation of 536W and a nominal turn-off time of 360ns, this product provides unmatched value and efficiency to customers seeking top-of-the-line solutions for their projects. Trust Onsemi's expertise in semiconductor manufacturing to deliver exceptional products that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, increasing durability and reliability.

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs generally have lower conduction losses and higher efficiency compared to P-Channel IGBTs.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified circuit design and saves space by integrating the diode within the IGBT.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in power management systems.

Maximum VCEsat: 2.4 V

Low voltage drop across the collector-emitter terminals helps in minimizing power loss and improving efficiency.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and fitting in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Easy to solder and mount on circuit boards, providing secure connections for reliable operation.

Nominal Turn Off Time (toff): 360 ns

Fast turn-off time reduces switching losses and improves overall efficiency of power control systems.

No. of Terminals: 4

Sufficient number of terminals for connecting to external circuits and components in power control applications.

Maximum Power Dissipation (Abs): 536 W

High power dissipation capability allows for handling large power loads without overheating or damage.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy and secure mounting in power electronic systems.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without losing performance, suitable for demanding industrial applications.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating allows for handling high voltage applications with safety and reliability.

Transistor Element Material: SILICON

Silicon material provides good thermal conductivity and electrical properties, ensuring stable and efficient operation.

Maximum Gate-Emitter Voltage: 20 V

Sufficient voltage rating for gate control, ensuring smooth and reliable switching of the IGBT.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold conditions without losing functionality, suitable for a wide range of environments.

Maximum Collector Current (IC): 160 A

High collector current rating allows for handling large current loads in power control applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Threshold voltage ensures reliable turn-on of the IGBT, critical for proper functioning in power control circuits.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability, ensuring secure connections for optimal performance.

Terminal Position: SINGLE

Single terminal position simplifies connection and installation, reducing complexity in circuit design.

Nominal Turn On Time (ton): 65 ns

Fast turn-on time allows for quick response in power control applications, improving efficiency and performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB40N120FL2WAG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

360 ns

Nominal Turn On Time (ton):

65 ns

Maximum VCEsat:

2.4 V

Trade Compliance

NGTB40N120FL2WAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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