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NGTB30N60L2WG

Onsemi

NGTB30N60L2WG by Onsemi

NGTB30N60L2WG by Onsemi is an N-CHANNEL IGBT with 225W power dissipation, 600V collector-emitter voltage, and 100A collector current. Ideal for high-power applications requiring efficient switching capabilities in industrial machinery, renewable energy systems, and motor control equipment.

Median Price

$4.630

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 46 parts In-Stock

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$4.630

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Digiode

USA . 1,368 parts In-Stock

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$4.398

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Vyrian

USA . 7,615 parts In-Stock

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Corphita

USA . 715 parts In-Stock

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$4.167

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715

$4.167

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Corohmni

South Africa . 472 parts In-Stock

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$4.630

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472

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Microchip USA

USA . 6,313 parts In-Stock

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$29.770

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Kulean Microsystems

USA . 8,019 parts In-Stock

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Problanco Electronics

Mexico . 6,689 parts In-Stock

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SupplyDigital Components

Austria . 2,578 parts In-Stock

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TANS Electronics

Latvia . 2,376 parts In-Stock

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UHIMA Technologies

Türkiye . 629 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of innovation with the NGTB30N60L2WG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability. This Insulated Gate Bipolar Transistor (IGBT) offers exceptional performance and efficiency, making it ideal for a wide range of applications. From industrial to automotive sectors, this N-channel transistor provides superior power dissipation and voltage capabilities. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NGTB30N60L2WG and experience the difference today.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching capabilities, making them suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 225 W

With a high maximum power dissipation, this IGBT can handle heavy loads and provide reliable performance under demanding conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature ensures that this IGBT can be used in applications where high temperatures are common without compromising performance.

Maximum Collector-Emitter Voltage: 600 V

The high maximum collector-emitter voltage allows for the handling of high voltages, making this IGBT suitable for a variety of power control applications.

Maximum Gate-Emitter Voltage: 20 V

With a high maximum gate-emitter voltage, this IGBT offers reliable gate control for precise switching and operation.

Maximum Collector Current (IC): 100 A

The high maximum collector current allows for the handling of large currents, making this IGBT suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

The low gate-emitter threshold voltage ensures efficient gate control and low power consumption, making this IGBT energy-efficient.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections for long-term performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) NGTB30N60L2WG attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JESD-609 Code:

e3

Maximum Operating Temperature:

175 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Trade Compliance

NGTB30N60L2WG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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