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MPS404A

Onsemi

MPS404A by Onsemi

PNP; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .15 A; JESD-609 Code: e0; Package Shape: ROUND;

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ace Electronics

USA . 52 parts In-Stock

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$2.000

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Vyrian

USA . 5,422 parts In-Stock

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M&R Communications

USA . 2,201 parts In-Stock

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Digiode

USA . 1,484 parts In-Stock

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Standard Data Resources

USA . 100 parts In-Stock

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100

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Bristol Electronics

USA . 83 parts In-Stock

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83

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LittleDiode

UK . 50 parts In-Stock

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50

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Electronic Expediters

USA . 46 parts In-Stock

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MISTER SPROCKETS

USA . 38 parts In-Stock

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Electronics Depot

USA . 31 parts In-Stock

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Prism Electronics

USA . 27 parts In-Stock

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Inland Empire Components Inc.

USA . 24 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 7 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,601 parts In-Stock

1+ parts

$0.500

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$1.624

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1,601

$0.500

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$1.624

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DigiPath Technology Company

USA . 583 parts In-Stock

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$0.551

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$0.507

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583

$0.551

$0.507

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ChromeModa Solutions

Germany . 1,405 parts In-Stock

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$0.562

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$0.461

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$0.562

$0.461

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IDEA Electronic Components Group

UK . 734 parts In-Stock

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$0.562

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$0.506

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734

$0.562

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Corohmni

South Africa . 348 parts In-Stock

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$2.000

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348

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AZTECH Wire

Italy . 680 parts In-Stock

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$11.983

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680

$11.983

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One Stop Electronics

USA . 427 parts In-Stock

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$41.050

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427

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Problanco Electronics

Mexico . 7,518 parts In-Stock

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Kulean Microsystems

USA . 5,005 parts In-Stock

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Corphita

USA . 4,430 parts In-Stock

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TANS Electronics

Latvia . 2,963 parts In-Stock

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SupplyDigital Components

Austria . 2,673 parts In-Stock

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UHIMA Technologies

Türkiye . 468 parts In-Stock

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Infinite Electronics LLP (Excess)

. 324 parts In-Stock

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Perfect Parts

USA . 26 parts In-Stock

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Assy Fe

Spain . 4 parts In-Stock

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Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MPS404A attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

35 V

Configuration:

Minimum DC Current Gain (hFE):

30

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

PNP

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

CHOPPER

Transistor Element Material:

SILICON

Trade Compliance

MPS404A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-00-260-4323, 5961002604323

NIIN

002604323

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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