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MMBV432LT1

Onsemi

MMBV432LT1 by Onsemi

MMBV432LT1 by Onsemi is a varactor diode with common cathode, 2 elements configuration. It has a min quality factor of 100 and nominal capacitance of 45.55 pF, suitable for very high frequency applications requiring abrupt variable capacitance diodes in small outline packages.

Median Price

$0.626

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 5,700 parts In-Stock

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$0.657

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$0.620

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Eagle Technology Solutions

USA . 510,228 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Electronics Depot

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J & M Industries LLC

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Q Components

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Digiode

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Lighthouse Electronics, Inc.

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Semi Source

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Vyrian

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Corohmni

South Africa . 449 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 7,075 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

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Overview

Enhance your electronic designs with the MMBV432LT1 by Onsemi, a high-quality varactor diode that offers precise variable capacitance for very high-frequency applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this diode features a common cathode configuration with 2 elements and a minimum quality factor of 100. Ideal for use in RF tuning circuits, voltage-controlled oscillators, and frequency synthesizers, the MMBV432LT1 provides excellent performance and reliability. Take your projects to the next level with this versatile diode that delivers value, benefits, and advantages to customers looking for top-notch components.

Feature Benefit Bullets

Minimum Quality Factor: 100

A minimum quality factor of 100 indicates high efficiency and performance, making this varactor diode a reliable choice for high frequency applications.

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection, ensuring the varactor diode is well-suited for a wide range of environmental conditions.

Config: COMMON CATHODE, 2 ELEMENTS

The common cathode configuration with 2 elements allows for flexible circuit design and efficient operation in various electronic applications.

Variable Capacitance Diode Classification: ABRUPT

The abrupt variable capacitance diode classification enables precise and rapid capacitance changes, making it ideal for frequency tuning and modulation circuits.

Frequency Band: VERY HIGH FREQUENCY

Designed for very high frequency operations, this varactor diode ensures reliable performance in advanced communication systems and radar applications.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for compact designs, making it suitable for modern electronic devices with limited space.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of handling and efficient placement on circuit boards, contributing to streamlined production processes.

No. of Terminals: 3

With 3 terminals, this varactor diode provides versatile connectivity options and allows for easy integration into a variety of circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space utilization, making it suitable for compact electronic devices and reducing overall system footprint.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish ensures reliable soldering connections, improving overall electrical performance and maintaining signal integrity.

Terminal Position: DUAL

The dual terminal position allows for secure attachment and stable connections, facilitating efficient signal transmission and minimizing signal loss.

Maximum Power Dissipation: 0.225 W

With a maximum power dissipation of 0.225 W, this varactor diode can handle high power levels without compromising its performance or reliability.

Nominal Diode Capacitance: 45.55 pF

The nominal diode capacitance of 45.55 pF provides precise tuning capabilities and stable operation, making it suitable for frequency control applications.

Minimum Breakdown Voltage: 14 V

The minimum breakdown voltage of 14 V ensures protection against voltage spikes and overloads, enhancing the overall durability and reliability of the diode.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient soldering processes and ensures the diode's integrity during assembly.

Peak Reflow Temperature °C: 235

The peak reflow temperature of 235 °C enables reliable soldering connections and ensures the diode's performance under varying temperature conditions.

Diode Type: VARIABLE CAPACITANCE DIODE

As a variable capacitance diode, this product offers precise control over capacitance values, making it ideal for frequency tuning and signal modulation applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure mounting and reliable electrical connections, promoting efficient signal transmission and minimizing signal distortion.

No. of Elements: 2

With 2 elements, this varactor diode offers enhanced functionality and flexibility in circuit design, allowing for customized applications and improved performance.

Maximum Repetitive Peak Reverse Voltage: 14 V

The maximum repetitive peak reverse voltage of 14 V ensures reliable operation and protection against reverse voltage conditions, enhancing the diode's durability.

Diode Cap Tolerance: 5.6 %

The diode capacitance tolerance of 5.6% provides consistent performance and accurate tuning capabilities, making it suitable for precision electronic applications.

Diode Element Material: SILICON

Constructed with silicon diode element material, this varactor diode offers high temperature stability and reliable performance, ensuring long-term functionality in demanding environments.

Minimum Diode Capacitance Ratio: 1.5

The minimum diode capacitance ratio of 1.5 indicates a wide range of capacitance values, allowing for versatile tuning options and adaptable circuit configurations.

Technical Specifications

Varactor Diodes MMBV432LT1 attributes and parameters. Explore more Varactor Diodes devices from Onsemi

Specs

Additional Features:

HIGH Q, 1% MATCHING GUARANTEED

Minimum Breakdown Voltage:

14 V

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Cap Tolerance:

5.6 %

Minimum Diode Capacitance Ratio:

1.5

Nominal Diode Capacitance:

45.55 pF

Diode Element Material:

SILICON

Frequency Band:

VERY HIGH FREQUENCY

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Maximum Power Dissipation:

.225 W

Qualification:

Not Qualified

Minimum Quality Factor:

100

Maximum Repetitive Peak Reverse Voltage:

14 V

Sub-Category:

Varactors

Surface Mount:

YES

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Variable Capacitance Diode Classification:

ABRUPT

Trade Compliance

MMBV432LT1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

NSN

5961-01-414-9172, 5961014149172

NIIN

014149172

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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