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MC10H640FNG

Onsemi

MC10H640FNG by Onsemi

MC10H640FNG clock driver by Onsemi features 7ns propagation delay, 6ns tpd, and 135MHz fmax. Ideal for applications requiring differential mux input conditioning in a square chip carrier package.

Median Price

$21.048

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,227 parts In-Stock

1+ parts

-

100+ parts

$18.710

1k+ parts

$16.740

10k+ parts

$15.750

4,227

-

$18.710

$16.740

$15.750

Verical

USA . 4,146 parts In-Stock

1+ parts

-

100+ parts

$23.387

1k+ parts

$20.925

10k+ parts

$19.688

4,146

-

$23.387

$20.925

$19.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,913 parts In-Stock

1+ parts

$19.788

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-

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1,913

$19.788

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Vyrian

USA . 7,732 parts In-Stock

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7,732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 156 parts In-Stock

1+ parts

$8.170

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156

$8.170

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Corphita

USA . 1,235 parts In-Stock

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$18.747

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1,235

$18.747

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Corohmni

South Africa . 362 parts In-Stock

1+ parts

$20.830

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362

$20.830

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Kulean Microsystems

USA . 8,316 parts In-Stock

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TANS Electronics

Latvia . 4,311 parts In-Stock

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Kepictronics

USA . 4,227 parts In-Stock

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4,227

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Problanco Electronics

Mexico . 3,829 parts In-Stock

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3,829

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SupplyDigital Components

Austria . 3,163 parts In-Stock

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UHIMA Technologies

Türkiye . 396 parts In-Stock

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Microchip USA

USA . 327 parts In-Stock

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Overview

Experience superior performance with the MC10H640FNG clock driver from Onsemi, a trusted manufacturer in the industry. Ideal for clock distribution applications, this high-quality chip carrier package offers a fast propagation delay of just 6 ns, ensuring efficient operation. With differential mux input conditioning and 28 terminals, this clock driver provides reliable signal transmission and precise timing control. Upgrade your system with the MC10H640FNG to enjoy seamless synchronization and enhanced overall performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures fast and efficient signal processing within the device.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL MUX

Utilizes differential multiplexing for improved signal integrity and noise immunity, resulting in reliable data transmission.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, making it compatible with a wide range of systems and applications.

Maximum I (ol): 24 Amp

High output current capability allows the clock driver to drive multiple loads without voltage drop or signal distortion.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed operation, making it suitable for applications requiring precise timing and synchronization.

Technical Specifications

Clock Drivers & Buffers MC10H640FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

10H

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Minimum fmax:

135 MHz

Trade Compliance

MC10H640FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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