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MC100LVEP111FAG

Onsemi

MC100LVEP111FAG by Onsemi

MC100LVEP111FAG clock driver by Onsemi features 0.5 ns propagation delay, 2.5V nominal voltage, and 10 true outputs. Ideal for industrial applications requiring low profile flatpack design with differential mux input conditioning.

Median Price

$6.144

Lifecycle Status

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32

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1k+

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Future Electronics

Canada . 54 parts In-Stock

1+ parts

$3.560

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$3.430

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$3.280

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Arrow

USA . 274 parts In-Stock

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$5.559

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$3.805

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$3.652

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$3.652

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Mouser Electronics

USA . 1,173 parts In-Stock

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$6.730

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$4.370

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$4.070

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DigiKey

USA . 224 parts In-Stock

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$6.730

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$4.370

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$3.943

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$3.837

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$4.370

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$3.837

Chip1Stop

Japan . 2 parts In-Stock

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Verical

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EBV Elektronik

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Nova Conductors

Japan . 100 parts In-Stock

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DF Sales Co.

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DF Sales Co.

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Digiode

USA . 1,698 parts In-Stock

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Vyrian

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Flip Electronics

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NAC Semi

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LWI Electronics Inc

India . 193 parts In-Stock

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Bristol Electronics

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Flex Direct, LLC

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LIBRA Elektronik GmbH

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Microfarads

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Semtec, LLC

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Lantek

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Speed Components Ltd

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Legend Electronics Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Prism Electronics

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Resion

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Semi Source

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Sea View Technologies

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IBS Electronics

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PC Components Company LLC

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Ampacity Inc.

Singapore . 271 parts In-Stock

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$3.930

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Semicontronic

India . 131 parts In-Stock

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$3.930

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$3.832

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$3.812

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Continental Prestige Electronics

USA . 6,797 parts In-Stock

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$4.061

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$3.979

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Argo Parts USA

USA . 4,529 parts In-Stock

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$4.061

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$4.142

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$4.142

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$4.142

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$4.142

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Corohmni

South Africa . 497 parts In-Stock

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$4.200

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Corphita

USA . 2,245 parts In-Stock

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Microchip USA

USA . 2,729 parts In-Stock

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$20.132

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Aztec Data Supply Inc.

USA . 1,835 parts In-Stock

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$24.380

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Perfect Parts

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Kepictronics

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SupplyDigital Components

Austria . 6,809 parts In-Stock

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Problanco Electronics

Mexico . 5,792 parts In-Stock

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Lixinc

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TANS Electronics

Latvia . 3,806 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

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UHIMA Technologies

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Glotronic Ltd.

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GreenTree Electronics

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Speed Components Ltd (Excess)

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Overview

Discover the innovative MC100LVEP111FAG clock driver by Onsemi, a leading manufacturer in the industry. Ideal for Clock Drivers & Buffers applications, this product offers unmatched quality and reliability. With a propagation delay of just 0.59 ns, differential mux input conditioning, and a wide operating temperature range, this clock driver delivers exceptional performance. Experience faster signal processing and seamless integration with the MC100LVEP111FAG, providing value and benefits that exceed customer expectations. Elevate your projects with Onsemi's cutting-edge technology and precision engineering.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material offers good durability and can protect the internal components from external elements.

Propagation Delay At Nominal Supply:

0.59 ns - With a low propagation delay, this product ensures quick response times for clock signals.

Surface Mount:

YES - The surface mount feature allows for easy installation and reduces the overall footprint of the product on a circuit board.

Input Conditioning:

DIFFERENTIAL MUX - The input conditioning provided by a differential multiplexer ensures reliable data transmission and minimizes signal interference.

Package Shape:

SQUARE - The square shape of the package provides a compact design that can fit efficiently within a circuit layout.

Nominal Supply Voltage / Vsup (V):

2.5 - The nominal supply voltage of 2.5V ensures compatibility with a wide range of electronic systems.

Power Supplies (V):

+-2.375/+-3.8 - The dual power supply options offer flexibility in voltage requirements for different applications.

No. of Terminals:

32 - The high number of terminals allows for versatile connectivity options and integration within complex circuit designs.

Package Style (Meter):

FLATPACK, LOW PROFILE - The flatpack, low profile design ensures space-saving and efficient utilization of board space.

Propagation Delay (tpd):

0.5 ns - With a low propagation delay of 0.5 ns, this product offers fast signal transmission for time-sensitive applications.

Maximum Operating Temperature:

85 °C - The high operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows for use in cold climates without risk of failure.

Terminal Finish:

MATTE TIN - The matte tin finish provides corrosion resistance and ensures a secure electrical connection.

Terminal Position:

QUAD - The quad terminal position facilitates easy soldering and connection within a circuit.

Maximum Seated Height:

1.6 mm - The low seated height makes this product suitable for compact and space-constrained applications.

Width:

7 mm - The 7mm width offers a slim profile that can be accommodated within tight spaces on a circuit board.

Minimum Supply Voltage (Vsup):

2.375 V - The minimum supply voltage of 2.375V ensures compatibility with low-power applications.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum reflow time of 30 seconds ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C:

260 - The peak reflow temperature of 260°C enables efficient soldering of the product onto the circuit board.

Length:

7 mm - The 7mm length provides a compact form factor that can easily fit within a circuit layout.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable operation in harsh industrial environments.

Technology:

ECL - The ECL technology used in this product offers high-speed performance and low power consumption.

Terminal Form:

GULL WING - The gull-wing terminal form allows for easy surface-mount soldering and robust mechanical support.

Terminal Pitch:

0.8 mm - The 0.8mm terminal pitch provides a suitable distance between terminals for easy connection and soldering.

Maximum Same Edge Skew (tskwd):

0.025 ns - The low same edge skew ensures accurate signal synchronization and timing control within the product.

No. of True Outputs:

10 - With 10 true outputs, this product can drive multiple clock signals simultaneously.

Moisture Sensitivity Level (MSL):

2 - The MSL level of 2 indicates that the product has moderate sensitivity to moisture, making it suitable for various environments.

Maximum Supply Voltage (Vsup):

3.8 V - The maximum supply voltage of 3.8V ensures compatibility with high-power applications and voltage requirements.

Technical Specifications

Clock Drivers & Buffers MC100LVEP111FAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.375/+-3.8

Propagation Delay At Nominal Supply:

.59 ns

Propagation Delay (tpd):

.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100LVEP111FAG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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