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MC10E111FNG

Onsemi

MC10E111FNG by Onsemi

MC10E111FNG clock driver by Onsemi features 0.66ns propagation delay, 5V nominal voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring differential input conditioning in a square chip carrier package.

Median Price

$6.430

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,580 parts In-Stock

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$6.430

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$6.430

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Rochester

USA . 7,442 parts In-Stock

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$5.560

1k+ parts

$4.970

10k+ parts

$4.680

7,442

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$5.560

$4.970

$4.680

Flip Electronics (Authorized)

USA . 2,516 parts In-Stock

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2,516

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Verical

USA . 1,909 parts In-Stock

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$6.938

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$6.200

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$5.838

1,909

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$6.938

$6.200

$5.838

Distributors (In-Stock)

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Digiode

USA . 1,135 parts In-Stock

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$5.871

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1,135

$5.871

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Vyrian

USA . 4,491 parts In-Stock

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USA . 2,516 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Cyclops Electronics Ltd

UK . 184 parts In-Stock

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184

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North Shore Components

USA . 63 parts In-Stock

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63

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,645 parts In-Stock

1+ parts

$5.250

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$5.250

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Corphita

USA . 211 parts In-Stock

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$5.562

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$5.562

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Corohmni

South Africa . 308 parts In-Stock

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$6.180

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$6.180

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Component Stockers USA

USA . 10,340 parts In-Stock

1+ parts

$6.270

100+ parts

$5.910

1k+ parts

$5.330

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$6.270

$5.910

$5.330

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Semicontronic

India . 4,704 parts In-Stock

1+ parts

$11.430

100+ parts

$11.144

1k+ parts

$11.087

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4,704

$11.430

$11.144

$11.087

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Aztec Data Supply Inc.

USA . 519 parts In-Stock

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$13.378

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519

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Kepictronics

USA . 9,000 parts In-Stock

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Microchip USA

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Continental Prestige Electronics

USA . 7,138 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 2,252 parts In-Stock

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TANS Electronics

Latvia . 1,646 parts In-Stock

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Problanco Electronics

Mexico . 1,117 parts In-Stock

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Kulean Microsystems

USA . 736 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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UHIMA Technologies

Türkiye . 250 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Overview

Elevate your clock driver and buffer solutions with the MC10E111FNG by Onsemi. Crafted with precision and expertise, this high-quality product offers unmatched reliability and performance in clock distribution applications. From its differential input conditioning to its ultra-fast propagation delay of just 0.66 ns, this chip carrier package is designed to meet the demands of industrial-grade environments. Trust Onsemi's expertise in clock drivers & buffers to deliver seamless synchronization and superior signal integrity, ensuring optimal performance for your electronic systems. Experience the benefits of Onsemi technology with the MC10E111FNG and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 0.66 ns

Ensures fast and accurate signal timing, ideal for high-speed clock applications.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and reducing assembly time.

Input Conditioning: DIFFERENTIAL

Supports differential input signals, providing noise immunity and signal integrity in data transmission.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V supply voltage, making it easy to integrate into existing systems.

Power Supplies (V): -5.2

Supports negative power supplies, enabling flexibility in power requirements for the clock driver.

No. of True Outputs: 9

Provides multiple output signals, allowing for versatility in connecting to various components in a system.

Maximum Operating Temperature: 85 °C

Can operate in a wide range of temperatures, suitable for industrial applications with varying environmental conditions.

Minimum Operating Temperature: -40 °C

Maintains functionality in cold temperatures, ensuring reliability in extreme operating environments.

Technical Specifications

Clock Drivers & Buffers MC10E111FNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0 V WITH VEE = -4.2 V TO -5.7 V

Family:

10E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Propagation Delay At Nominal Supply:

.66 ns

Propagation Delay (tpd):

.68 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

4.57 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10E111FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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