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MC100LVEL14DWG

Onsemi

MC100LVEL14DWG by Onsemi

MC100LVEL14DWG clock driver by Onsemi features 0.83 ns propagation delay, 3.3V nominal voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring differential mux input conditioning in a small outline package with 20 terminals.

Median Price

$6.237

Lifecycle Status

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Arrow

USA . 317 parts In-Stock

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$4.731

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Chip1Stop

Japan . 319 parts In-Stock

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Rochester

USA . 1,814 parts In-Stock

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$5.830

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$5.480

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$4.960

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$5.830

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Mouser Electronics

USA . 29 parts In-Stock

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$9.270

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$7.830

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Element14

Singapore . 8 parts In-Stock

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$12.310

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$8.470

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$7.790

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$12.310

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$7.790

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DigiKey

USA . 6,084 parts In-Stock

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$6.560

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Verical

USA . 4,484 parts In-Stock

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$6.237

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$5.575

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$5.250

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Digiode

USA . 1,054 parts In-Stock

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$4.446

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Bristol Electronics

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$8.960

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Flip Electronics

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Vyrian

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Semi Source

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Nova Conductors

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Microfarads

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Benley Electronics

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$2.000

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Semicontronic

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$3.980

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$3.880

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$3.861

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Ampacity Inc.

Singapore . 1,560 parts In-Stock

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$3.980

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Corphita

USA . 2,374 parts In-Stock

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$4.212

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Corohmni

South Africa . 437 parts In-Stock

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$4.680

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Component Stockers USA

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Continental Prestige Electronics

USA . 8 parts In-Stock

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$8.190

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$5.380

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Microchip USA

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$27.850

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$27.650

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$27.440

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Aztec Data Supply Inc.

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Perfect Parts

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Lixinc

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SupplyDigital Components

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Kulean Microsystems

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RC Electronics

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Argo Parts USA

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Glotronic Ltd.

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Overview

Enhance your clock driver and buffer applications with the MC100LVEL14DWG by Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge technology in a compact small outline package. This differential mux input conditioning device boasts a fast propagation delay of only 0.83 ns, ensuring precise timing control. Ideal for industrial-grade operations, this product offers maximum value with its 5 true outputs and wide operating temperature range. Elevate your designs with Onsemi's MC100LVEL14DWG and experience unmatched performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.88 ns

Offers fast signal propagation, allowing for efficient operation.

Surface Mount: YES

Enables easy and secure installation on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard supply voltages, making it suitable for a wide range of applications.

Temperature Grade: INDUSTRIAL

Can withstand a wide temperature range from -40°C to 85°C, making it suitable for industrial environments.

Terminal Finish: MATTE TIN

Provides a corrosion-resistant finish for the terminals, ensuring reliable connections.

No. of True Outputs: 5

Offers multiple output options for diverse connectivity requirements.

Technical Specifications

Clock Drivers & Buffers MC100LVEL14DWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V

Family:

100LVEL

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Propagation Delay At Nominal Supply:

.88 ns

Propagation Delay (tpd):

.83 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC100LVEL14DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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