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MC100EL14DWG

Onsemi

MC100EL14DWG by Onsemi

MC100EL14DWG clock driver by Onsemi features 0.83 ns propagation delay, 5 true outputs, and 20 terminals. Ideal for industrial applications requiring differential mux input conditioning and a supply voltage range of 4.2V to 5.7V in a small outline package style.

Median Price

$4.990

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$3.480

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1

$3.480

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Arrow

USA . 1 parts In-Stock

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$4.578

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1

$4.578

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Rochester

USA . 2,353 parts In-Stock

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$4.990

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$4.460

10k+ parts

$4.200

2,353

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$4.990

$4.460

$4.200

DigiKey

USA . 2,353 parts In-Stock

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$5.460

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$5.460

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Verical

USA . 2,066 parts In-Stock

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$6.237

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$5.575

10k+ parts

$5.250

2,066

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$6.237

$5.575

$5.250

Distributors (In-Stock)

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Digiode

USA . 974 parts In-Stock

1+ parts

$2.325

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974

$2.325

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Vyrian

USA . 1,401 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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ComSIT Distribution GmbH

Germany . 46 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,347 parts In-Stock

1+ parts

$2.080

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$2.080

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Semicontronic

India . 1,092 parts In-Stock

1+ parts

$2.080

100+ parts

$2.028

1k+ parts

$2.018

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1,092

$2.080

$2.028

$2.018

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Corphita

USA . 673 parts In-Stock

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$2.202

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673

$2.202

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Corohmni

South Africa . 380 parts In-Stock

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$2.447

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380

$2.447

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Component Stockers USA

USA . 2,634 parts In-Stock

1+ parts

$2.830

100+ parts

$5.400

1k+ parts

$4.880

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2,634

$2.830

$5.400

$4.880

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Aztec Data Supply Inc.

USA . 208 parts In-Stock

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$31.691

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208

$31.691

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Problanco Electronics

Mexico . 6,595 parts In-Stock

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Kulean Microsystems

USA . 4,409 parts In-Stock

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Continental Prestige Electronics

USA . 2,353 parts In-Stock

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TANS Electronics

Latvia . 1,390 parts In-Stock

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Argo Parts USA

USA . 1,144 parts In-Stock

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SupplyDigital Components

Austria . 664 parts In-Stock

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Microchip USA

USA . 425 parts In-Stock

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UHIMA Technologies

Türkiye . 307 parts In-Stock

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Bastille Electronics

Australia . 90 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Enhance your clock driving and buffering with the MC100EL14DWG by Onsemi. Manufactured with top-notch quality and precision, this product falls under the Clock Drivers & Buffers category, offering unmatched reliability and performance. Ideal for a variety of applications, this small outline package ensures minimal propagation delay and differential mux input conditioning, making it perfect for industrial use. Invest in the MC100EL14DWG today and experience the superior value, benefits, and advantages that only Onsemi can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.88 ns

Low propagation delay ensures fast and efficient operation of the clock driver, leading to better overall performance.

Input Conditioning: DIFFERENTIAL MUX

Differential multiplexer input conditioning helps in managing high-speed signals and enables precise signal control.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with existing systems easier and more convenient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this clock driver can withstand harsh environmental conditions and maintain stability.

Technical Specifications

Clock Drivers & Buffers MC100EL14DWG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100EL

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.88 ns

Propagation Delay (tpd):

.83 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

2.65 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC100EL14DWG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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