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MC100EP210SFAG

Onsemi

MC100EP210SFAG by Onsemi

MC100EP210SFAG by Onsemi is a clock driver & buffer with a propagation delay of 0.675 ns and operates at a nominal voltage of 2.5V. It is used in industrial applications that require precise timing and differential input conditioning.

Median Price

$21.890

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 154 parts In-Stock

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$20.770

100+ parts

$15.470

1k+ parts

$15.090

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154

$20.770

$15.470

$15.090

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DigiKey

USA . 152 parts In-Stock

1+ parts

$23.010

100+ parts

$16.049

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$15.092

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$23.010

$16.049

$15.092

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Chip1Stop

Japan . 3 parts In-Stock

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$51.500

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$51.500

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Flip Electronics (Authorized)

USA . 8,000 parts In-Stock

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Verical

USA . 8,000 parts In-Stock

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$13.837

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Distributors (In-Stock)

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$16.501

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$16.501

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Digiode

USA . 819 parts In-Stock

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$21.518

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$21.518

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Flip Electronics

USA . 7,750 parts In-Stock

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Vyrian

USA . 7,016 parts In-Stock

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Chip Stock

USA . 3,111 parts In-Stock

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Sensible Micro Corp

USA . 168 parts In-Stock

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Resion

USA . 45 parts In-Stock

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Cyclops Electronics Ltd

UK . 13 parts In-Stock

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Semi Source

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,017 parts In-Stock

1+ parts

$16.496

100+ parts

-

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$16.166

2,017

$16.496

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$16.166

Ampacity Inc.

Singapore . 2,052 parts In-Stock

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$19.250

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$19.250

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Semicontronic

India . 1,971 parts In-Stock

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$19.250

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$18.769

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$18.672

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$19.250

$18.769

$18.672

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Corphita

USA . 1,287 parts In-Stock

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$20.385

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Corohmni

South Africa . 471 parts In-Stock

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$20.600

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Aztec Data Supply Inc.

USA . 2,751 parts In-Stock

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$21.060

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Lixinc

USA . 10,507 parts In-Stock

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Argo Parts USA

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TANS Electronics

Latvia . 4,154 parts In-Stock

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Problanco Electronics

Mexico . 3,474 parts In-Stock

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Perfect Parts

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Kulean Microsystems

USA . 1,198 parts In-Stock

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SupplyDigital Components

Austria . 558 parts In-Stock

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UHIMA Technologies

Türkiye . 443 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 103 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$16.171

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$15.676

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$15.346

50

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$15.676

$15.346

Overview

Discover the MC100EP210SFAG by Onsemi, a high-quality clock driver and buffer that offers numerous advantages for your applications. With Onsemi's reputation for excellence in manufacturing, you can trust that this product is reliable and built to last. Whether you're working on telecommunications, data communications, or networking projects, this clock driver and buffer delivers unparalleled performance and precision. Experience the value of its differential input conditioning, low propagation delay, and wide temperature range. With its small package size and surface mount capability, it's easy to integrate into your designs. Trust Onsemi and elevate your projects with the MC100EP210SFAG.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.675 ns

Low propagation delay ensures high-speed performance and accuracy of the clock signals.

Input Conditioning: Differential

Differential input conditioning allows for noise rejection and improved signal integrity.

Nominal Supply Voltage/Vsup: 2.5V

Operates at a standard voltage level, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial and harsh environments.

Terminal Finish: Matte Tin

Matte tin terminal finish provides good solderability and corrosion resistance.

Technical Specifications

Clock Drivers & Buffers MC100EP210SFAG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Family:

100E

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

2

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

.675 ns

Propagation Delay (tpd):

.65 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

MC100EP210SFAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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