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MC100LVEP14DTR2G

Onsemi

MC100LVEP14DTR2G by Onsemi

MC100LVEP14DTR2G clock driver by Onsemi features 0.525ns propagation delay, 2.5V nominal voltage, and 2000MHz min fmax. Ideal for industrial applications requiring differential mux input conditioning in a small outline package with surface mount capability.

Median Price

$7.580

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

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Mouser Electronics

USA . 3,520 parts In-Stock

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$7.580

100+ parts

$4.960

1k+ parts

$4.480

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$4.260

3,520

$7.580

$4.960

$4.480

$4.260

DigiKey

USA . 2,609 parts In-Stock

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$7.580

100+ parts

$4.959

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$4.485

10k+ parts

$4.367

2,609

$7.580

$4.959

$4.485

$4.367

Chip1Stop

Japan . 2,063 parts In-Stock

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$7.707

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$5.504

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$4.168

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$7.707

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Arrow

USA . 2,500 parts In-Stock

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Verical

USA . 2,500 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 56 parts In-Stock

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$4.651

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Digiode

USA . 1,441 parts In-Stock

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Chip Stock

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Cyclops Electronics Ltd

UK . 5,200 parts In-Stock

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Vyrian

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EMSNET

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Bristol Electronics

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LIBRA Elektronik GmbH

Germany . 598 parts In-Stock

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Component Sense

UK . 436 parts In-Stock

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Netsource Technology, Inc.

USA . 290 parts In-Stock

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Martec Srl

Italy . 200 parts In-Stock

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Atlantic Semiconductor

USA . 112 parts In-Stock

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Quantum Digital Technology

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Resion

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,902 parts In-Stock

1+ parts

$3.950

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$3.950

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Semicontronic

India . 1,842 parts In-Stock

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$3.950

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$3.851

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$3.832

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$3.950

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$3.832

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Corohmni

South Africa . 200 parts In-Stock

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$4.364

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$4.364

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Continental Prestige Electronics

USA . 4,735 parts In-Stock

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$4.651

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$4.558

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Netroflash

USA . 2,000 parts In-Stock

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$4.651

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$4.418

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$4.325

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$4.651

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$4.325

Corphita

USA . 2,293 parts In-Stock

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$6.184

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Component Stockers USA

USA . 9,291 parts In-Stock

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$7.630

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$5.710

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$4.030

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Aztec Data Supply Inc.

USA . 185 parts In-Stock

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$19.470

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Microchip USA

USA . 4,044 parts In-Stock

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$29.110

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$28.930

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$28.840

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$28.750

4,044

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$28.750

Perfect Parts

USA . 78,622 parts In-Stock

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Metaverse IC Inc.

Canada . 32,650 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

Mexico . 8,318 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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TANS Electronics

Latvia . 4,504 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Assy Fe

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Argo Parts USA

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GreenTree Electronics

Israel . 247 parts In-Stock

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UHIMA Technologies

Türkiye . 114 parts In-Stock

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Overview

Unleash the power of precision clocking with the MC100LVEP14DTR2G by Onsemi. Designed with top-notch quality and expertise, this clock driver & buffer offers unparalleled performance for a wide range of applications. With a lightning-fast propagation delay of just 0.525 ns, differential mux input conditioning, and a compact rectangular package shape, this innovative product delivers precise synchronization and reliable signal integrity. Elevate your designs to new heights with the MC100LVEP14DTR2G and experience the difference that quality engineering can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 0.525 ns

Low propagation delay ensures fast processing of signals, making the product efficient.

Surface Mount: YES

Surface mount design allows for easy installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a commonly used supply voltage, ensuring compatibility with standard power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the product can function in extreme cold environments.

No. of True Outputs: 5

Multiple outputs provide flexibility in signal distribution, making the product versatile.

Minimum fmax: 2000 MHz

High maximum frequency allows for fast data processing, suitable for high-speed applications.

Technical Specifications

Clock Drivers & Buffers MC100LVEP14DTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V

Family:

100LVE

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay At Nominal Supply:

.525 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.025 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

2000 MHz

Trade Compliance

MC100LVEP14DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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