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5962-0723001VXC

Texas Instruments

5962-0723001VXC by Texas Instruments

5962-0723001VXC clock driver by Texas Instruments features a Schmitt trigger mux for input conditioning, 3-state output characteristics, and operates in a temperature range of -55 to 125°C. With a max supply voltage of 3.6V, it is ideal for military applications requiring high-speed performance up to 1500MHz with radiation tolerance up to 25k Rad(Si).

Median Price

$3,141.675

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 159 parts In-Stock

1+ parts

$3,141.675

100+ parts

$2,805.067

1k+ parts

-

10k+ parts

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159

$3,141.675

$2,805.067

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 92 parts In-Stock

1+ parts

$2,750.066

100+ parts

-

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92

$2,750.066

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Digiode

USA . 3,879 parts In-Stock

1+ parts

$2,984.591

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3,879

$2,984.591

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-

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Vyrian

USA . 159 parts In-Stock

1+ parts

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159

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VNN

France . 100 parts In-Stock

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100

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Semi Source

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Andel Nordic

Denmark . 10 parts In-Stock

1+ parts

$6.492

100+ parts

-

1k+ parts

$6.232

10k+ parts

$6.232

10

$6.492

-

$6.232

$6.232

AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$11.828

100+ parts

-

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483

$11.828

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Parana Technologies

USA . 2,026 parts In-Stock

1+ parts

$25.025

100+ parts

-

1k+ parts

$25.710

10k+ parts

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2,026

$25.025

-

$25.710

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ChromeModa Solutions

Germany . 3,643 parts In-Stock

1+ parts

$28.118

100+ parts

$23.057

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3,643

$28.118

$23.057

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IDEA Electronic Components Group

UK . 499 parts In-Stock

1+ parts

$28.118

100+ parts

$26.712

1k+ parts

$25.306

10k+ parts

-

499

$28.118

$26.712

$25.306

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Ampacity Inc.

Singapore . 159 parts In-Stock

1+ parts

$2,670.420

100+ parts

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159

$2,670.420

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Semicontronic

India . 159 parts In-Stock

1+ parts

$2,670.420

100+ parts

$2,603.660

1k+ parts

$2,590.307

10k+ parts

-

159

$2,670.420

$2,603.660

$2,590.307

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Continental Prestige Electronics

USA . 4,680 parts In-Stock

1+ parts

$2,750.066

100+ parts

-

1k+ parts

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10k+ parts

$2,695.065

4,680

$2,750.066

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-

$2,695.065

Argo Parts USA

USA . 3,131 parts In-Stock

1+ parts

$2,750.066

100+ parts

$2,722.565

1k+ parts

$2,695.065

10k+ parts

$2,667.564

3,131

$2,750.066

$2,722.565

$2,695.065

$2,667.564

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2,750.066

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2,000

$2,750.066

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Corphita

USA . 1,806 parts In-Stock

1+ parts

$2,827.508

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1,806

$2,827.508

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Metaverse IC Inc.

Canada . 100,000 parts In-Stock

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100,000

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Lixinc

USA . 13,861 parts In-Stock

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13,861

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Microchip USA

USA . 1,215 parts In-Stock

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1,215

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DigiPath Technology Company

USA . 755 parts In-Stock

1+ parts

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$25.351

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755

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$25.351

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Perfect Parts

USA . 243 parts In-Stock

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243

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Overview

Elevate your clock driver and buffer needs with the 5962-0723001VXC by Texas Instruments. Crafted with precision and excellence, this product offers unrivaled quality for military-grade applications. With a package body material of ceramic and metal-sealed cofired, this clock driver ensures optimal performance and reliability in extreme conditions. Whether you're looking to enhance your electronic systems or streamline your operations, this innovative solution provides the value, benefits, and advantages that customers like you deserve. Experience the difference with Texas Instruments - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material offers high reliability and durability, making the product suitable for a wide range of operating conditions.

Surface Mount: YES

Ease of installation and space-saving design for modern electronic applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard voltage requirements in many electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand higher temperatures, making it suitable for demanding industrial or military environments.

Minimum Operating Temperature: -55 °C

Operates reliably in cold environments, ensuring consistent performance in extreme conditions.

No. of True Outputs: 5

Provides multiple output options, enhancing flexibility in connecting to other devices or components.

Minimum fmax: 1500 MHz

High frequency capability allows for faster signal processing and data transmission.

Technical Specifications

Clock Drivers & Buffers 5962-0723001VXC attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

USER DEFINABLE FIVE DIFFERENTIAL LVPECL OUTPUT; DIFFERENTIAL VCO IN CLOCK

Family:

7005

Input Conditioning:

SCHMITT TRIGGER MUX

JESD-30 Code:

S-CQFP-F52

Length:

13.97 mm

Load Capacitance (CL):

10 pF

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, GUARD RING

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Qualified

Maximum Same Edge Skew (tskwd):

3.2 ns

Screening Level:

MIL-PRF-38535 Class V

Maximum Seated Height:

2.68 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Total Dose (V):

25k Rad(Si)

Width:

13.97 mm

Minimum fmax:

1500 MHz

Trade Compliance

5962-0723001VXC Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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