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5962-9676101QRA

Texas Instruments

5962-9676101QRA by Texas Instruments

The Texas Instruments clock driver 5962-9676101QRA has a propagation delay of 7ns, operates at a supply voltage of 5V, and offers 8 true outputs. Ideal for military applications due to MIL-PRF-38535 Class Q screening level and BICMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,871 parts In-Stock

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5,871

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Digiode

USA . 2,621 parts In-Stock

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2,621

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Distributors (Availability)

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Parana Technologies

USA . 913 parts In-Stock

1+ parts

$15.000

100+ parts

-

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$15.422

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913

$15.000

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$15.422

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AZTECH Wire

Italy . 407 parts In-Stock

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$15.690

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407

$15.690

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ChromeModa Solutions

Germany . 6,145 parts In-Stock

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$16.854

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$13.820

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6,145

$16.854

$13.820

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IDEA Electronic Components Group

UK . 1,103 parts In-Stock

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$16.854

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$16.011

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$15.169

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1,103

$16.854

$16.011

$15.169

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One Stop Electronics

USA . 128 parts In-Stock

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$26.000

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128

$26.000

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Corphita

USA . 1,906 parts In-Stock

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1,906

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Northwest PG Solutions

USA . 1,087 parts In-Stock

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Native Components

USA . 154 parts In-Stock

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DigiPath Technology Company

USA . 14 parts In-Stock

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$15.196

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Overview

Enhance your electronic designs with the 5962-9676101QRA Clock Drivers & Buffers from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments products always deliver superior performance. Ideal for military-grade applications, this ceramic, glass-sealed package offers a fast propagation delay of just 7 ns at a nominal supply voltage of 5V. With 8 true outputs and a maximum I (ol) of 48 Amp, this product ensures efficient operation even in extreme temperatures ranging from -55 to 125°C. Upgrade your projects with the unmatched value and benefits of Texas Instruments' clock drivers & buffers.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components, ensuring reliability in various environmental conditions.

Propagation Delay At Nominal Supply: 7 ns

The low propagation delay ensures fast and efficient signal transmission, making this clock driver suitable for high-speed applications where timing accuracy is crucial.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with common electronic systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this clock driver can withstand elevated temperatures and maintain stable performance in demanding industrial or military applications.

Maximum Same Edge Skew (tskwd): 1.9 ns

The low same edge skew helps in maintaining synchronization and accurate timing of signals, enhancing the overall efficiency and reliability of the clock driver.

Technical Specifications

Clock Drivers & Buffers 5962-9676101QRA attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T20

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

20

No. of True Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

1.9 ns

Screening Level:

MIL-PRF-38535 Class Q

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-9676101QRA Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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