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5962F9217402VXC

STMicroelectronics

5962F9217402VXC by STMicroelectronics

5962F9217402VXC by STMicroelectronics is a military-grade clock driver with a propagation delay of just 8.5 ns and operates b/w 2-5.5 V. Its ceramic, metal-sealed package ensures durability in harsh environments. Ideal for precision timing applications, it supports up to 50 A output.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 1,609 parts In-Stock

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Anansix

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Vyrian

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IDEA Electronic Components Group

UK . 1,677 parts In-Stock

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$18.204

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$16.384

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MKK Technologies

India . 1,950 parts In-Stock

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$34.232

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DigiPath Technology Company

USA . 1,950 parts In-Stock

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$34.232

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Northwest PG Solutions

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Parana Technologies

USA . 851 parts In-Stock

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Native Components

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Corphita

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Overview

Unlock unparalleled performance and reliability with the 5962F9217402VXC from STMicroelectronics. Engineered for precision, this clock driver excels in demanding military applications, boasting exceptional temperature resilience and low propagation delay. With ST’s stellar reputation for quality and innovation, you gain peace of mind while enhancing system efficiency. Elevate your projects with a dependable component that delivers unmatched value and performance, ensuring your success in even the most rigorous environments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package material ensures robust structural integrity and reliability in harsh environments.

Propagation Delay At Nominal Supply: 14 ns

A low propagation delay enables faster signal processing, enhancing overall circuit performance.

Surface Mount: YES

Surface mount technology allows for efficient space-saving designs and automated assembly processes.

Input Conditioning: STANDARD

Standard input conditioning makes it compatible with a variety of input signal formats for versatile applications.

Screening Level: MIL-PRF-38535 Class V

Class V screening ensures high reliability and performance for military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape provides an efficient layout for PCB design, optimizing space and connectivity.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V is power-efficient for modern electronic systems.

Power Supplies (V): 2/5.5

Supports a wide range of supply voltages, making it adaptable to various design requirements.

No. of Terminals: 14

With 14 terminals, this device offers ample connectivity for complex applications.

Package Style (Meter): FLATPACK

Flatpack style enhances thermal performance and allows for easier integration into compact assemblies.

Maximum I (ol): 50 Amp

The ability to handle up to 50 Amps enables this driver to drive significant loads effectively.

Propagation Delay (tpd): 8.5 ns

An even lower propagation delay of 8.5 ns improves timing performance in high-speed applications.

Maximum Operating Temperature: 125 °C

Withstand high operating temperatures, making it suitable for extreme environments.

Minimum Operating Temperature: -55 °C

The wide operating temperature range ensures reliable performance in cold climates.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout design and efficient signal routing.

Minimum Supply Voltage (Vsup): 2 V

The capability to operate at a minimum supply voltage of 2V enhances its versatility in low-power designs.

Temperature Grade: MILITARY

Military grade components guarantee durability and reliability under harsh operating conditions.

Total Dose: 300k Rad(Si)

This high total dose rating makes the device suitable for radiation-sensitive applications.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operation, ideal for modern applications.

Terminal Form: FLAT

Flat terminals provide excellent solderability and improve electrical performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for compact designs, facilitating ease of board layout.

Maximum Same Edge Skew (tskwd): 0.7 ns

Low skew values ensure synchronized signal outputs, which is crucial for high-precision applications.

No. of True Outputs: 8

Having 8 true outputs provides ample signal distribution capability for complex designs.

Maximum Supply Voltage (Vsup): 5.5 V

Supports up to 5.5 V supply voltage, providing flexibility in high-performance applications.

Technical Specifications

Clock Drivers & Buffers 5962F9217402VXC attributes and parameters. Explore more Clock Drivers & Buffers devices from STMicroelectronics

Specs

Family:

AC

Input Conditioning:

STANDARD

JESD-30 Code:

R-CDFP-F14

Logic IC Type:

Maximum I (ol):

50 Amp

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

14

No. of True Outputs:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL14,.25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

14 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Qualified

Maximum Same Edge Skew (tskwd):

.7 ns

Screening Level:

MIL-PRF-38535 Class V

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Total Dose (V):

300k Rad(Si)

Trade Compliance

5962F9217402VXC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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