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5962-9754001QXX

Texas Instruments

5962-9754001QXX by Texas Instruments

The Texas Instruments clock driver 5962-9754001QXX is a MILITARY-grade BICMOS technology component with 12 true outputs, operating at a max frequency of 100 MHz. It features a flatpack package style, with surface mount capability and standard input conditioning. Ideal for applications requiring precise timing control in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,832

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-

-

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Digiode

USA . 2,469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,469

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 323 parts In-Stock

1+ parts

$4.557

100+ parts

-

1k+ parts

$4.375

10k+ parts

$4.375

323

$4.557

-

$4.375

$4.375

AZTECH Wire

Italy . 814 parts In-Stock

1+ parts

$14.194

100+ parts

-

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814

$14.194

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Parana Technologies

USA . 859 parts In-Stock

1+ parts

$17.006

100+ parts

-

1k+ parts

$17.230

10k+ parts

-

859

$17.006

-

$17.230

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DigiPath Technology Company

USA . 1,555 parts In-Stock

1+ parts

$18.726

100+ parts

$17.228

1k+ parts

-

10k+ parts

-

1,555

$18.726

$17.228

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ChromeModa Solutions

Germany . 3,985 parts In-Stock

1+ parts

$19.108

100+ parts

$15.669

1k+ parts

-

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3,985

$19.108

$15.669

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IDEA Electronic Components Group

UK . 338 parts In-Stock

1+ parts

$19.108

100+ parts

$18.153

1k+ parts

$17.197

10k+ parts

-

338

$19.108

$18.153

$17.197

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Native Components

USA . 160 parts In-Stock

1+ parts

$55.360

100+ parts

-

1k+ parts

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10k+ parts

$53.146

160

$55.360

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-

$53.146

Northwest PG Solutions

USA . 1,359 parts In-Stock

1+ parts

$60.896

100+ parts

-

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1,359

$60.896

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One Stop Electronics

USA . 1,214 parts In-Stock

1+ parts

$62.000

100+ parts

-

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10k+ parts

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1,214

$62.000

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Corphita

USA . 536 parts In-Stock

1+ parts

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536

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Overview

Elevate your clock driver performance with the 5962-9754001QXX by Texas Instruments. Crafted with precision and expertise, this ceramic, glass-sealed beauty offers unparalleled reliability and durability for your applications. Whether you're in aerospace, defense, or industrial sectors, this 3-STATE output buffer is designed to meet your stringent requirements with its MIL-PRF-38535 Class Q screening level. Experience seamless operation and peace of mind knowing that Texas Instruments has your back with this top-of-the-line clock driver.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and reliability of the product, making it suitable for various applications and environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V offers compatibility with a wide range of systems and devices, providing flexibility in integration.

Output Characteristics: 3-STATE

The 3-STATE output characteristics enable the device to control multiple outputs independently, enhancing functionality and performance.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh environmental conditions and critical applications.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high speed and low-power performance for efficient operation.

Technical Specifications

Clock Drivers & Buffers 5962-9754001QXX attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDFP-F56

Length:

18.415 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

56

No. of True Outputs:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.75 ns

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

3.05 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

9.655 mm

Minimum fmax:

100 MHz

Trade Compliance

5962-9754001QXX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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