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NB6L11DTG

Onsemi

NB6L11DTG by Onsemi

NB6L11DTG clock driver by Onsemi features a propagation delay of 0.2 ns, differential input conditioning, and operates at industrial temperature grade. With a package style of small outline and thin profile, it is suitable for applications requiring precise timing synchronization in electronic systems. The device has dual terminals with a terminal pitch of 0.65 mm and can operate within a supply voltage range of +-2.5/+-3.3 V.

Median Price

$15.714

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$8.349

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70

$8.349

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Component Electronics Inc.

Canada . 142 parts In-Stock

1+ parts

$23.080

100+ parts

$17.310

1k+ parts

$15.000

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142

$23.080

$17.310

$15.000

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Vyrian

USA . 8,137 parts In-Stock

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Digiode

USA . 1,772 parts In-Stock

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Chip Stock

USA . 963 parts In-Stock

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963

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Bristol Electronics

USA . 86 parts In-Stock

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86

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Speed Components Ltd

Israel . 10 parts In-Stock

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10

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North Shore Components

USA . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,104 parts In-Stock

1+ parts

$7.000

100+ parts

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1,104

$7.000

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Continental Prestige Electronics

USA . 6,039 parts In-Stock

1+ parts

$8.349

100+ parts

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$8.182

6,039

$8.349

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$8.182

Netroflash

USA . 500 parts In-Stock

1+ parts

$8.349

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500

$8.349

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Aztec Data Supply Inc.

USA . 298 parts In-Stock

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$11.790

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298

$11.790

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AZTECH Wire

Italy . 601 parts In-Stock

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$16.569

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601

$16.569

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Corohmni

South Africa . 333 parts In-Stock

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$23.080

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333

$23.080

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Kulean Microsystems

USA . 6,280 parts In-Stock

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SupplyDigital Components

Austria . 3,449 parts In-Stock

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Argo Parts USA

USA . 3,259 parts In-Stock

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Problanco Electronics

Mexico . 3,121 parts In-Stock

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Kepictronics

USA . 3,016 parts In-Stock

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3,016

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TANS Electronics

Latvia . 2,364 parts In-Stock

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2,364

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Corphita

USA . 1,888 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,601 parts In-Stock

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1,601

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Perfect Parts

USA . 1,314 parts In-Stock

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Microchip USA

USA . 476 parts In-Stock

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476

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UHIMA Technologies

Türkiye . 6 parts In-Stock

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6

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Overview

Enhance your clock signal with the NB6L11DTG by Onsemi, a top-quality clock driver & buffer perfect for various applications. Manufactured by Onsemi, known for their exceptional products, this device offers unmatched reliability and performance. With a propagation delay of just 0.22 ns, differential input conditioning, and a small outline package, this clock driver provides precise timing solutions for industrial-grade projects. Trust in Onsemi's expertise and elevate your designs with the NB6L11DTG for seamless operation and optimal efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 0.22 ns

Low propagation delay ensures fast and efficient signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design, ideal for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage ensures consistent performance and reliable operation of the product.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes this product suitable for industrial environments with varying temperature conditions.

Technical Specifications

Clock Drivers & Buffers NB6L11DTG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.22 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L11DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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