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NB6L11DG

Onsemi

NB6L11DG by Onsemi

NB6L11DG clock driver by Onsemi features a propagation delay of 0.2 ns, operates at a nominal voltage of 2.5V, and has differential input conditioning. This small outline package with gull wing terminals is ideal for industrial applications requiring precise signal synchronization and low skew requirements.

Median Price

$10.360

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11 parts In-Stock

1+ parts

$10.360

100+ parts

$10.150

1k+ parts

$9.950

10k+ parts

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11

$10.360

$10.150

$9.950

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Distributors (In-Stock)

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Digiode

USA . 1,679 parts In-Stock

1+ parts

$9.842

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1,679

$9.842

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Flip Electronics

USA . 2,666 parts In-Stock

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$15.780

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2,666

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Vyrian

USA . 2,524 parts In-Stock

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Chip Stock

USA . 825 parts In-Stock

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825

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SPM Sales

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25

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Distributors (Availability)

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Continental Prestige Electronics

USA . 17 parts In-Stock

1+ parts

$9.170

100+ parts

$6.870

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17

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$6.870

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Corphita

USA . 1,439 parts In-Stock

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$9.324

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1,439

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Corohmni

South Africa . 287 parts In-Stock

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$10.360

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287

$10.360

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AZTECH Wire

Italy . 295 parts In-Stock

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$16.050

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$16.050

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Advanced Electronics

New Zealand . 75 parts In-Stock

1+ parts

$20.537

100+ parts

$18.689

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$16.840

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75

$20.537

$18.689

$16.840

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Problanco Electronics

Mexico . 6,821 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Lixinc

USA . 4,237 parts In-Stock

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Component Stockers USA

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Perfect Parts

USA . 1,239 parts In-Stock

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TANS Electronics

Latvia . 687 parts In-Stock

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Microchip USA

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Kepictronics

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Kulean Microsystems

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SupplyDigital Components

Austria . 134 parts In-Stock

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UHIMA Technologies

Türkiye . 79 parts In-Stock

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Assy Fe

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Overview

Enhance your electronics projects with the NB6L11DG by Onsemi, a top-quality clock driver & buffer designed to meet your timing requirements. With its differential input conditioning and small outline package style, this component offers precise signal propagation at minimal delay (0.22 ns) for optimal performance. Onsemi's reputation for excellence ensures reliability and efficiency in all applications, making this product a valuable asset for your designs. Upgrade your projects today and experience the benefits of superior quality and precision with the NB6L11DG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 0.22 ns

Offers fast signal processing speed, making this clock driver suitable for high-speed applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Input Conditioning: DIFFERENTIAL

Enables accurate and reliable signal processing, particularly in environments with high levels of noise or interference.

Nominal Supply Voltage: 2.5V

Operates efficiently at a standard voltage level, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

Ensures the clock driver can withstand high temperatures, suitable for industrial and harsh environment applications.

Terminal Finish: TIN

Provides corrosion resistance and good electrical conductivity for reliable connections.

No. of True Outputs: 2

Offers multiple output options for flexibility in design and compatibility with various clocking systems.

Technical Specifications

Clock Drivers & Buffers NB6L11DG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.22 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NB6L11DG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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