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NB6L11DR2G

Onsemi

NB6L11DR2G by Onsemi

NB6L11DR2G clock driver by Onsemi features a propagation delay of 0.22 ns, differential input conditioning, and operates at a temperature range of -40 to 85 °C. With a small outline package style and dual terminal position, it is ideal for industrial applications requiring precise signal synchronization.

Median Price

$7.510

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,240 parts In-Stock

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$7.510

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$7.510

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Rochester

USA . 1,065 parts In-Stock

1+ parts

-

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$6.490

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$5.810

10k+ parts

$5.460

1,065

-

$6.490

$5.810

$5.460

Verical

USA . 967 parts In-Stock

1+ parts

-

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$8.113

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$7.688

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967

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$8.113

$7.688

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Distributors (In-Stock)

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Digiode

USA . 429 parts In-Stock

1+ parts

$6.859

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429

$6.859

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Vyrian

USA . 2,363 parts In-Stock

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$7.220

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$7.220

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Flip Electronics

USA . 2,666 parts In-Stock

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2,666

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Bristol Electronics

USA . 2,168 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,487 parts In-Stock

1+ parts

$6.498

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1,487

$6.498

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Corohmni

South Africa . 383 parts In-Stock

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$7.220

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383

$7.220

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$39.954

100+ parts

$36.358

1k+ parts

$32.762

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50

$39.954

$36.358

$32.762

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Kulean Microsystems

USA . 8,047 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,501 parts In-Stock

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TANS Electronics

Latvia . 4,702 parts In-Stock

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Problanco Electronics

Mexico . 1,632 parts In-Stock

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Continental Prestige Electronics

USA . 1,190 parts In-Stock

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$6.150

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UHIMA Technologies

Türkiye . 890 parts In-Stock

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SupplyDigital Components

Austria . 723 parts In-Stock

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Kepictronics

USA . 550 parts In-Stock

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550

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Microchip USA

USA . 414 parts In-Stock

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414

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Overview

Elevate your clock driving needs with the NB6L11DR2G by Onsemi. Crafted with precision and expertise, Onsemi's clock drivers & buffers deliver unparalleled quality and reliability. Perfect for a wide range of applications, this product offers customers exceptional value with its fast propagation delay, differential input conditioning, and compact package style. Experience seamless performance and efficiency with the NB6L11DR2G, designed to meet industrial standards and exceed expectations. Upgrade your clock driving solutions today with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring reliable performance and easy handling.

Propagation Delay At Nominal Supply: 0.22 ns

Fast propagation delay ensures efficient operation and accurate timing.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides better noise immunity and signal integrity.

Nominal Supply Voltage / Vsup (V): 2.5

Ideal supply voltage for stable and consistent operation of the clock driver.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for various industrial applications.

Technical Specifications

Clock Drivers & Buffers NB6L11DR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.22 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NB6L11DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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