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NB6L11MMNG

Onsemi

NB6L11MMNG by Onsemi

NB6L11MMNG by Onsemi is a clock driver with 0.325 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 2.5V and supports differential input conditioning. This chip carrier package has 16 terminals and can withstand temperatures from -40 to 85°C.

Median Price

$15.990

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 123 parts In-Stock

1+ parts

$13.840

100+ parts

$8.500

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-

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123

$13.840

$8.500

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Mouser Electronics

USA . 418 parts In-Stock

1+ parts

$15.990

100+ parts

$10.830

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$10.000

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418

$15.990

$10.830

$10.000

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DigiKey

USA . 150 parts In-Stock

1+ parts

$15.990

100+ parts

$11.843

1k+ parts

$10.165

10k+ parts

-

150

$15.990

$11.843

$10.165

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Newark

USA . 113 parts In-Stock

1+ parts

$17.290

100+ parts

$11.710

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$10.800

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113

$17.290

$11.710

$10.800

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Element14

Singapore . 27 parts In-Stock

1+ parts

$23.120

100+ parts

$14.640

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$14.450

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27

$23.120

$14.640

$14.450

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Verical

USA . 6,765 parts In-Stock

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$9.297

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6,765

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$9.297

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Rochester

USA . 962 parts In-Stock

1+ parts

-

100+ parts

$9.240

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$8.270

10k+ parts

$7.780

962

-

$9.240

$8.270

$7.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,738 parts In-Stock

1+ parts

$9.756

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1,738

$9.756

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Flip Electronics

USA . 6,642 parts In-Stock

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6,642

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Vyrian

USA . 5,960 parts In-Stock

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5,960

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ComSIT Distribution GmbH

Germany . 103 parts In-Stock

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103

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Inventory MP

USA . 5 parts In-Stock

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5

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Bristol Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 393 parts In-Stock

1+ parts

$8.730

100+ parts

-

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393

$8.730

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Semicontronic

India . 71 parts In-Stock

1+ parts

$8.730

100+ parts

$8.512

1k+ parts

$8.468

10k+ parts

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71

$8.730

$8.512

$8.468

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Corphita

USA . 1,534 parts In-Stock

1+ parts

$9.243

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1,534

$9.243

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Corohmni

South Africa . 240 parts In-Stock

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$10.270

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240

$10.270

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Continental Prestige Electronics

USA . 5 parts In-Stock

1+ parts

$13.630

100+ parts

$10.340

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5

$13.630

$10.340

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Aztec Data Supply Inc.

USA . 1,745 parts In-Stock

1+ parts

$26.740

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1,745

$26.740

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Problanco Electronics

Mexico . 6,486 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,542 parts In-Stock

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TANS Electronics

Latvia . 4,268 parts In-Stock

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Kulean Microsystems

USA . 3,430 parts In-Stock

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Argo Parts USA

USA . 3,021 parts In-Stock

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SupplyDigital Components

Austria . 1,635 parts In-Stock

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Bastille Electronics

Australia . 750 parts In-Stock

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750

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Perfect Parts

USA . 696 parts In-Stock

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Lixinc

USA . 482 parts In-Stock

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UHIMA Technologies

Türkiye . 183 parts In-Stock

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Emar International I/E

Canada . 100 parts In-Stock

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Authorized Procurement Solutions

USA . 18 parts In-Stock

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Overview

Enhance your electronic designs with the NB6L11MMNG clock driver & buffer by Onsemi. Trusted for its superior quality and reliability, Onsemi delivers cutting-edge solutions for a wide range of applications. This chip carrier, heat sink/slug package boasts a very thin profile, making it ideal for space-constrained designs. With a propagation delay of just 0.325 ns, this differential input conditioning device ensures precision timing and seamless synchronization. Upgrade your projects with the NB6L11MMNG and experience the unparalleled value and performance that Onsemi products offer.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.325 ns

Low propagation delay ensures fast and accurate data transmission.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in minimizing noise and interference for reliable operation.

Nominal Supply Voltage / Vsup (V): 2.5

Works efficiently at a standard supply voltage of 2.5V, making it compatible with various systems.

Package Shape: SQUARE

Square package shape facilitates compact and space-saving design layout.

Maximum Operating Temperature: 85 °C

Withstands high operating temperatures for reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without compromising functionality.

Terminal Finish: NICKEL GOLD PALLADIUM

Durable terminal finish for long-term reliability and corrosion resistance.

No. of True Outputs: 2

Provides multiple true outputs for driving clock signals to different components effectively.

Maximum Supply Voltage (Vsup): 3.63 V

Supports a maximum supply voltage of 3.63V, ensuring compatibility with a wide range of power sources.

Technical Specifications

Clock Drivers & Buffers NB6L11MMNG attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

16

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.325 ns

Propagation Delay (tpd):

.325 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L11MMNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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