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NB6L11DTR2G

Onsemi

NB6L11DTR2G by Onsemi

NB6L11DTR2G clock driver by Onsemi has a propagation delay of 0.22 ns, operates at a nominal voltage of 2.5V, and offers differential input conditioning. This small outline package with gull wing terminals is ideal for industrial applications requiring precise timing synchronization in electronic systems.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Bristol Electronics

USA . 4,016 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 374 parts In-Stock

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$17.720

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Ampacity Inc.

Singapore . 1,363 parts In-Stock

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$38.000

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Component Stockers USA

USA . 240 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,722 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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TANS Electronics

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A-Z Elektronik GmbH

Germany . 5,148 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Metaverse IC Inc.

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SupplyDigital Components

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Corphita

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Futuretech Components

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Overview

Upgrade your clock drivers and buffers with the NB6L11DTR2G by Onsemi. Known for its high-quality products, Onsemi delivers reliable solutions for a wide range of applications. With a propagation delay of just 0.22 ns and a nominal supply voltage of 2.5V, this clock driver offers exceptional performance and precision. Its differential input conditioning ensures accurate signal processing, making it ideal for industrial-grade systems. Trust Onsemi to provide top-notch clock drivers that guarantee efficiency and reliability in your designs. Elevate your projects with the NB6L11DTR2G and experience unparalleled value and benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and can withstand harsh environmental conditions, making this product reliable for long-term use.

Propagation Delay At Nominal Supply: 0.22 ns

Low propagation delay ensures efficient signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, making this product convenient for compact designs.

Input Conditioning: DIFFERENTIAL

Differential input conditioning provides noise immunity and accurate signal processing, making this product suitable for critical data transmission.

Nominal Supply Voltage / Vsup (V): 2.5

Stable nominal supply voltage ensures consistent performance, making this product reliable in various operating conditions.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable operation in industrial environments, making this product suitable for diverse applications.

Terminal Finish: MATTE TIN

Matte tin finish provides solderability and corrosion resistance, ensuring reliable connections for optimal performance of this product.

No. of True Outputs: 2

Having multiple true outputs enhances signal distribution capabilities, making this product versatile for driving multiple clock signals.

Technical Specifications

Clock Drivers & Buffers NB6L11DTR2G attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.22 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB6L11DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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