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NB6L11D

Onsemi

NB6L11D by Onsemi

NB6L11D clock driver by Onsemi features a propagation delay of 0.2 ns, differential input conditioning, and operates at a temperature range of -40 to 85°C. With a small outline package style and dual terminal position, it is suitable for industrial applications requiring precise timing synchronization. The device supports a nominal voltage of 2.5V and offers two true outputs with low skew for high-speed signal processing.

Median Price

$7.328

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 17,140 parts In-Stock

1+ parts

-

100+ parts

$6.930

1k+ parts

$6.340

10k+ parts

-

17,140

-

$6.930

$6.340

-

DigiKey

USA . 17,056 parts In-Stock

1+ parts

-

100+ parts

$8.130

1k+ parts

-

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-

17,056

-

$8.130

-

-

Rochester

USA . 15,511 parts In-Stock

1+ parts

-

100+ parts

$6.180

1k+ parts

$5.530

10k+ parts

$5.200

15,511

-

$6.180

$5.530

$5.200

Verical

USA . 8,970 parts In-Stock

1+ parts

-

100+ parts

$7.725

1k+ parts

$6.912

10k+ parts

$6.500

8,970

-

$7.725

$6.912

$6.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,261 parts In-Stock

1+ parts

$6.850

100+ parts

-

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1,261

$6.850

-

-

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Vyrian

USA . 84 parts In-Stock

1+ parts

$6.930

100+ parts

-

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84

$6.930

-

-

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Flip Electronics

USA . 2,666 parts In-Stock

1+ parts

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2,666

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Electronics Depot

USA . 93 parts In-Stock

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93

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,959 parts In-Stock

1+ parts

$6.489

100+ parts

-

1k+ parts

-

10k+ parts

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1,959

$6.489

-

-

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Corohmni

South Africa . 207 parts In-Stock

1+ parts

$6.930

100+ parts

-

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207

$6.930

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Continental Prestige Electronics

USA . 17,718 parts In-Stock

1+ parts

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17,718

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TANS Electronics

Latvia . 8,304 parts In-Stock

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8,304

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SupplyDigital Components

Austria . 7,224 parts In-Stock

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7,224

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Problanco Electronics

Mexico . 6,684 parts In-Stock

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6,684

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A-Z Elektronik GmbH

Germany . 5,565 parts In-Stock

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5,565

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Kulean Microsystems

USA . 1,142 parts In-Stock

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1,142

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UHIMA Technologies

Türkiye . 465 parts In-Stock

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465

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Overview

Enhance your project with the NB6L11D by Onsemi, a top-quality clock driver & buffer designed to deliver precise timing and synchronization. Manufactured by the trusted brand Onsemi, this product guarantees reliability and performance. With its differential input conditioning and small outline package style, the NB6L11D is ideal for a wide range of applications where accurate clock signals are crucial. Experience the value and benefits this product brings, from its fast propagation delay of 0.2 ns to its industrial-grade temperature range. Upgrade your system now with the NB6L11D and unlock new possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 0.22 ns

Low propagation delay ensures fast and efficient signal processing in clock distribution, leading to accurate timing synchronization.

Surface Mount: YES

Surface mount capability makes installation easy and allows for compact and space-saving designs in electronic devices.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making the clock driver suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 2.5

Stable nominal supply voltage ensures consistent performance of the clock driver in various operating conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows the clock driver to function reliably in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range enables the clock driver to perform reliably in harsh cold conditions without any issues.

Terminal Finish: TIN LEAD

Tin lead finish provides good conductivity and solderability for easy assembly and maintenance of the clock driver.

Width: 3.9 mm

Narrow width offers flexibility in placement and integration of the clock driver in space-constrained electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the clock driver can operate reliably in rugged industrial environments without performance degradation.

Technical Specifications

Clock Drivers & Buffers NB6L11D attributes and parameters. Explore more Clock Drivers & Buffers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

6L

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

8

No. of True Outputs:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Propagation Delay At Nominal Supply:

.22 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.015 ns

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

NB6L11D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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