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LMK1D1208RHDT

Texas Instruments

LMK1D1208RHDT by Texas Instruments

LMK1D1208RHDT clock driver by Texas Instruments features a propagation delay of 0.575 ns, 16 true outputs, and a min operating temperature of -40°C. Ideal for industrial applications requiring differential input conditioning and a nominal voltage of 1.8V. Package style is chip carrier with very thin profile, suitable for surface mount assembly.

Median Price

$13.550

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,591 parts In-Stock

1+ parts

$9.448

100+ parts

$7.703

1k+ parts

$5.135

10k+ parts

-

17,591

$9.448

$7.703

$5.135

-

DigiKey

USA . 3,038 parts In-Stock

1+ parts

$13.550

100+ parts

$9.173

1k+ parts

$8.457

10k+ parts

-

3,038

$13.550

$9.173

$8.457

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Mouser Electronics

USA . 1,916 parts In-Stock

1+ parts

$13.550

100+ parts

$9.180

1k+ parts

-

10k+ parts

-

1,916

$13.550

$9.180

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$7.892

100+ parts

-

1k+ parts

-

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10

$7.892

-

-

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Digiode

USA . 1,778 parts In-Stock

1+ parts

$8.976

100+ parts

-

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1,778

$8.976

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Semtec, LLC

USA . 15,000 parts In-Stock

1+ parts

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15,000

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Vyrian

USA . 5,958 parts In-Stock

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5,958

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Chip Stock

USA . 4,100 parts In-Stock

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4,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,842 parts In-Stock

1+ parts

$5.450

100+ parts

-

1k+ parts

-

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5,842

$5.450

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Andel Nordic

Denmark . 1,958 parts In-Stock

1+ parts

$6.107

100+ parts

-

1k+ parts

$5.863

10k+ parts

$5.863

1,958

$6.107

-

$5.863

$5.863

Continental Prestige Electronics

USA . 6,070 parts In-Stock

1+ parts

$7.892

100+ parts

-

1k+ parts

-

10k+ parts

$7.735

6,070

$7.892

-

-

$7.735

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.892

100+ parts

-

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500

$7.892

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Corphita

USA . 1,024 parts In-Stock

1+ parts

$8.503

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1,024

$8.503

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Parana Technologies

USA . 759 parts In-Stock

1+ parts

$13.608

100+ parts

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$14.109

10k+ parts

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759

$13.608

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$14.109

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DigiPath Technology Company

USA . 800 parts In-Stock

1+ parts

$14.984

100+ parts

$13.785

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800

$14.984

$13.785

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ChromeModa Solutions

Germany . 6,880 parts In-Stock

1+ parts

$15.290

100+ parts

$12.538

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6,880

$15.290

$12.538

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IDEA Electronic Components Group

UK . 205 parts In-Stock

1+ parts

$15.290

100+ parts

$14.526

1k+ parts

$13.761

10k+ parts

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205

$15.290

$14.526

$13.761

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Argo Parts USA

USA . 1,337 parts In-Stock

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1,337

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iodParts Technologies Inc.

India . 10 parts In-Stock

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10

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Overview

Enhance your electronic designs with the Texas Instruments LMK1D1208RHDT Clock Driver & Buffer. Crafted by a reputable manufacturer, this product offers unparalleled quality and reliability. Ideal for applications requiring precise timing control, this chip carrier with a very thin profile provides differential input conditioning and a propagation delay of only 0.575 ns. With a wide temperature range and low power consumption, this clock driver is perfect for industrial use. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the LMK1D1208RHDT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for various applications.

Propagation Delay At Nominal Supply: 0.575 ns

With a low propagation delay, this product ensures accurate and timely data transmission.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design in electronic circuits.

Input Conditioning: DIFFERENTIAL

The differential input conditioning enhances signal integrity and reduces noise interference.

Package Shape: SQUARE

The square package shape provides a compact design, suitable for tight spaces in electronic systems.

Nominal Supply Voltage / Vsup (V): 1.8

The 1.8V nominal supply voltage ensures compatibility with a wide range of electronic devices.

No. of Terminals: 28

The 28 terminals offer flexibility for connecting to various components in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink, and thin profile design contribute to efficient heat dissipation and space optimization.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this product suitable for industrial applications in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term use.

Terminal Position: QUAD

The quad terminal position facilitates easy connection and secure mounting in circuit boards.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and space-efficient PCB layout.

Width: 5 mm

The 5mm width contributes to a compact and streamlined design for efficient integration in electronic systems.

Minimum Supply Voltage (Vsup): 1.71 V

The 1.71V minimum supply voltage ensures compatibility with low-power devices while maintaining optimal performance.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature simplifies the manufacturing process and ensures reliability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures secure soldering and component integrity during manufacturing processes.

Length: 5 mm

The 5mm length contributes to a compact and space-efficient design for electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions.

Terminal Form: NO LEAD

The lead-free terminal form complies with environmental regulations and enhances product sustainability.

Packing Method: TR

The TR packing method provides convenient handling and storage for efficient product distribution.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch facilitates precise connections and minimizes signal interference in the circuit.

Maximum Same Edge Skew (tskwd): 0.02 ns

The low maximum same edge skew ensures accurate signal timing and data synchronization in the circuit.

No. of True Outputs: 16

The 16 true outputs offer versatility and compatibility with various output configurations in electronic systems.

Minimum fmax: 2000 MHz

The minimum 2000MHz fmax ensures high-speed performance and data processing capabilities.

Maximum Supply Voltage (Vsup): 1.89 V

The 1.89V maximum supply voltage accommodates voltage variations and ensures stable operation in the circuit.

Maximum Power Supply Current (ICC): 95 mA

The 95mA maximum power supply current ensures efficient power management and prevents overloading of the circuit.

Technical Specifications

Clock Drivers & Buffers LMK1D1208RHDT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

95 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.575 ns

Maximum Same Edge Skew (tskwd):

.02 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Minimum fmax:

2000 MHz

Trade Compliance

LMK1D1208RHDT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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